SUBSTRATE SUPPORTER
    1.
    发明公开
    SUBSTRATE SUPPORTER 审中-公开

    公开(公告)号:US20240321619A1

    公开(公告)日:2024-09-26

    申请号:US18439492

    申请日:2024-02-12

    CPC classification number: H01L21/6833 H01L21/67288 H01L21/02271

    Abstract: The present disclosure relates to substrate supporters and substrate processing apparatuses. An example substrate supporter includes an upper surface on which a substrate is loaded, a base, an outer dam extending along an edge of the base, a contact band connected with the outer dam, extending along the circumferential direction of the base, and onto which the substrate is loaded, and a first contact pattern disposed adjacent to the contact band and extending into an inside of the contact band, the first contact pattern extending along the circumferential direction of the base, where an area of the first contact pattern is larger than an area where the contact band overlaps with the substrate.

    SUBSTRATE SUPPORT DEVICE
    2.
    发明公开

    公开(公告)号:US20240318314A1

    公开(公告)日:2024-09-26

    申请号:US18609067

    申请日:2024-03-19

    CPC classification number: C23C16/4586 C23C16/46

    Abstract: A substrate support device includes a chuck plate, a shaft connected to a center lower end of the chuck plate, a heater unit provided inside the chuck plate, an electrode unit provided inside the chuck plate, and provided on the heater unit, a jumper unit provided inside the chuck plate, arranged between the electrode unit and the heater unit, and electrically connected to the electrode unit to supply power to the electrode unit, and a power control unit, wherein the electrode unit includes a center electrode and a first electrode arranged in a ring shape around the center electrode, wherein the jumper unit includes a first jumper connected to the first electrode and a center jumper connected to the center electrode, and wherein the first jumper includes a first connection jumper, and a first inclined jumper electrically connecting the first jumper.

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