公开(公告)号：US11244839B2

公开(公告)日：2022-02-08

申请号：US16385919

申请日：2019-04-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheonkyu Lee ,  Siqing Lu ,  Takafumi Noguchi

IPC: H01L21/67 ,  H01L21/683 ,  H01J37/32

Abstract: A plasma processing apparatus includes a process chamber, a substrate chuck disposed in the process chamber, and a temperature controller. The substrate chuck is configured to receive a substrate, and includes a cooling channel through which a coolant flows. The temperature controller is configured to control a temperature of the coolant supplied to the cooling channel. The temperature controller includes a cooler configured to cool the coolant supplied to the cooling channel, a heater configured to heat the coolant supplied to the cooling channel, and a 3-way valve configured to regulate a first flow rate of the coolant passing through the cooler and a second flow rate of the coolant passing through the heater.

公开(公告)号：US10818503B2

公开(公告)日：2020-10-27

申请号：US16260816

申请日：2019-01-29

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Cheonkyu Lee ,  Moonseok Kim ,  Iksu Byun ,  Changwoo Song ,  Seongha Jeong ,  Dongseok Han

IPC: H01L21/3065 ,  H01J37/32 ,  H01L21/311

Abstract: A method of etching at a low temperature includes cooling a pedestal on which a wafer is disposed, etching the wafer by generating plasma from a gas supplied through a gas distribution unit, and injecting a heated inert gas into the chamber through the gas distribution unit.

公开(公告)号：US12106945B2

公开(公告)日：2024-10-01

申请号：US17528321

申请日：2021-11-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Siqing Lu ,  Cheonkyu Lee ,  Takafumi Noguchi

IPC: H01J37/32 ,  C23C14/54 ,  C23C16/458 ,  C23C16/46 ,  H01L21/67

CPC classification number: H01J37/32724 ,  C23C14/541 ,  C23C16/4586 ,  C23C16/463 ,  H01L21/67248 ,  H01J2237/2065 ,  H01J2237/3344

Abstract: A plasma processing apparatus includes a process chamber, a substrate support chuck configured to support a substrate in the process chamber, the substrate support chuck including an upper cooling channel and a lower cooling channel that are symmetrically separated from each other, and a support chuck temperature controller configured to supply a first coolant to the upper cooling channel and to supply a second coolant to the lower cooling channel.