公开(公告)号：US10377861B2

公开(公告)日：2019-08-13

申请号：US15538827

申请日：2015-12-22

Applicant: SABIC Global Technologies B.V.

Inventor： Chen Xu ,  Hao Zhou ,  Wei Zhao

IPC: C08L79/08 ,  C08G73/10 ,  C08K3/04 ,  C08K3/28 ,  C09D179/08 ,  H05K1/03 ,  C08L71/00 ,  C08L81/06 ,  C08K3/38

Abstract: A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320 C, preferably 245 to 312 C, and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260 C, preferably 260 to 350 C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.

公开(公告)号：US20190315923A1

公开(公告)日：2019-10-17

申请号：US16448387

申请日：2019-06-21

Applicant: SABIC Global Technologies B.V.

Inventor： Chen Xu ,  Hao Zhou ,  Wei Zhao

IPC: C08G73/10 ,  C08L81/06 ,  C08K3/04 ,  H05K1/03 ,  C08L79/08 ,  C08L71/00 ,  C09D179/08 ,  C08K3/28

Abstract: A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320° C., preferably 245 to 312° C., and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260° C., preferably 260 to 350° C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.

公开(公告)号：US20170362386A1

公开(公告)日：2017-12-21

申请号：US15538827

申请日：2015-12-22

Applicant: SABIC Global Technologies B.V.

Inventor： Chen Xu ,  Hao Zhou ,  Wei Zhao

IPC: C08G73/10 ,  C08K3/04 ,  H05K1/03 ,  C09D179/08 ,  C08L79/08 ,  C08K3/28 ,  C08K3/38

CPC classification number: C08G73/1071 ,  C08G73/1064 ,  C08K3/04 ,  C08K3/28 ,  C08K2003/385 ,  C08L71/00 ,  C08L79/08 ,  C08L81/06 ,  C09D179/08 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209

Abstract: A polyetherimide composition is disclosed including a polyetherimide sulfone having a glass transition temperature of 240 to 320 C, preferably 245 to 312 C, and a particulate, thermally conductive filler composition. A layer of the polyetherimide composition resists deformation as determined by IPC method TM-650 when subjected to a lead-free solder reflow process at a temperature of greater than or equal to 260 C, preferably 260 to 350 C. A layer including the polyetherimide composition further has a thermal conductivity of 2.5 to 15 W/mK, preferably 3 to 12 W/mK, as determined in accordance with ISO 22007-2:2008.