公开(公告)号：US20230411323A1

公开(公告)日：2023-12-21

申请号：US18188781

申请日：2023-03-23

Applicant: RENESAS ELECTRONICS CORPORATION

Inventor： Etsuko WATANABE ,  Takashi TONEGAWA

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L23/49513 ,  H01L24/40 ,  H01L24/48 ,  H01L24/05 ,  H01L24/73 ,  H01L24/03 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/06051 ,  H01L2224/06181 ,  H01L2224/06505 ,  H01L2224/06102 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2924/0132 ,  H01L2224/05186 ,  H01L2924/04941 ,  H01L2224/05124 ,  H01L2224/05138 ,  H01L2924/01014 ,  H01L2224/05147 ,  H01L2924/0133 ,  H01L2224/05155 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05644 ,  H01L2224/05624 ,  H01L2224/05638 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05118 ,  H01L2224/05567 ,  H01L2224/03464 ,  H01L2224/48245 ,  H01L2224/48091 ,  H01L2224/37147 ,  H01L2224/37139 ,  H01L2224/40245 ,  H01L24/29 ,  H01L2224/29139 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/73263 ,  H01L24/37

Abstract: A dielectric layer has a first opening exposing a surface of a first conductive layer and a second opening exposing a surface of a second conductive layer and having an opening area smaller than an opening area of the first opening. A material of the surface of the second conductive layer exposed from the second opening is different from a material of the surface of the first conductive layer exposed from the first opening, and includes aluminum.