公开(公告)号：US11250197B1

公开(公告)日：2022-02-15

申请号：US17079727

申请日：2020-10-26

Applicant: QUALCOMM Incorporated

Inventor： Vinod Kumar Lakshmipathi ,  Venugopal Sanaka ,  Babu Suriamoorthy ,  Madan Krishnappa ,  Pavan Kumar Patibanda

IPC: G06F30/30 ,  G06F30/392 ,  G06F30/347 ,  G06F30/394 ,  G06F115/06 ,  G06F115/10 ,  G06F115/02 ,  G06F119/06

Abstract: Various embodiments may include integrated circuits (ICs) and methods for designing an integrated circuit (IC), such as a system-on-chip (SOC). Embodiments include methods for planning and producing ICs without communication channels, also referred to as channel-less ICs. Embodiments may include overlay hard macros that support routing and communication design without dedicated communication channels being needed between functional hard macros, such as cores of a SOC. Various embodiments may include an IC in which one or more interconnect hard macros and wires connecting a first functional hard macro, a second functional hard macro and the one or more interconnect hard macros are located within a third functional hard macro. In some embodiments, no communication channel may be present between the first functional hard macro, the second functional hard macro, and the third functional hard macro.