公开(公告)号：US20170284708A1

公开(公告)日：2017-10-05

申请号：US15086039

申请日：2016-03-30

Applicant: QUALCOMM Incorporated

Inventor： Peng WANG ,  Unnikrishnan VADAKKANMARUVEEDU ,  Vinay MITTER

IPC: F25B21/04

CPC classification number: F25B21/04 ,  G06F1/20 ,  G06F1/203 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32

Abstract: An active heat transfer device is proposed for heat management in apparatuses such as mobile devices. The proposed heat transfer device may include a thermoelectric (TE) layer, and first and second electrodes both on lateral surfaces of the TE layer. When there is a voltage differential between the first and second electrodes, heat from a heat source may be transferred laterally within the TE layer from the first electrode to the second electrode.

公开(公告)号：US20150261267A1

公开(公告)日：2015-09-17

申请号：US14594984

申请日：2015-01-12

Applicant: QUALCOMM Incorporated

Inventor： Unnikrishnan VADAKKANMARUVEEDU ,  Jon James ANDERSON ,  Vinay MITTER ,  Peng WANG

IPC: G06F1/20 ,  H05K7/20 ,  C09K5/14 ,  G06F1/16

CPC classification number: G06F1/203 ,  C09K5/14 ,  F28F13/003 ,  G06F1/1626 ,  G06F1/163 ,  G06F1/182 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/1633 ,  Y10T29/49002 ,  Y10T428/2982

Abstract: An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (ρ) and density (Cp) for the material, such that k*ρ*Cp is between 0 (J*W)/(m4*K2) and 1,000,000 (J*W)/(m4*K2). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m3, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m3, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m3, and a specific heat between 1900-2000 J/kg-K.

Abstract translation: 电子设备包括壳体，壳体具有多个侧面和壳体中的电子部件。 多孔和导热材料与壳体相关联。 该材料具有导热性（k）和10％至70％之间的孔隙率，其导致该材料的比热（＆rgr;）和密度（Cp），使得k *＆rgr; * Cp在0（ J * W）/（m4 * K2）和1,000,000（J * W）/（m4 * K2）。 该材料可以是：热导率在0.5-2W / m-K之间，密度在1000-2500kg / m3之间，比热在500-1000J / kg-K之间的玻璃基材料; 热导率在300-400W / m-K之间，密度在4000-8000kg / m 3和比热200-300J / kg-K之间的金属基材料; 并且具有导热性的塑料基材料可以在0.1-0.4W / m-K之间，密度在400-1000kg / m 3之间，比热在1900-2000J / kg-K之间。

公开(公告)号：US20150043156A1

公开(公告)日：2015-02-12

申请号：US13963248

申请日：2013-08-09

Applicant: QUALCOMM INCORPORATED

Inventor： Ankur JAIN ,  Unni VADAKKANMARUVEEDU ,  Vinay MITTER

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F2200/1633 ,  H04M1/72575

Abstract: The various embodiments provide methods and systems for adjusting the thermal mitigation system of a mobile electronic device when an add-on outer casing is attached. The mobile electronic device determine whether an add-on outer case is attached to the mobile electronic device and change a thermal mitigation parameter of a thermal mitigation process implemented on the mobile electronic device in response. The determination may be via a sensor or a user input. A changed thermal mitigation parameter may be stored in memory, or input by a user or in a communication from the add-on case. The changed thermal mitigation parameter may be determined based on a particular make, model or properties of the add-on case, and/or may be obtained from a database stored in the device or accessed via a network. Removal of the case may be detected and the thermal mitigation parameter returned to an initial value.

Abstract translation: 各种实施例提供了当附加外壳时调整移动电子设备的热缓解系统的方法和系统。 移动电子设备确定附加外壳是否附接到移动电子设备，并且响应地改变在移动电子设备上实现的热缓解过程的热缓解参数。 该确定可以通过传感器或用户输入。 改变的热缓解参数可以存储在存储器中，或者由用户输入或来自附加箱的通信。 改变的热缓解参数可以基于附加情况的特定品牌，型号或属性来确定，和/或可以从存储在设备中的数据库中获得或经由网络访问。 可以检测到情况的移除并且热缓解参数返回到初始值。

公开(公告)号：US20140262160A1

公开(公告)日：2014-09-18

申请号：US13842444

申请日：2013-03-15

Applicant: QUALCOMM INCORPORATED

Inventor： Unnikrishnan VADAKKANMARUVEEDU ,  Mulugeta K. BERHE ,  Vinay MITTER ,  Ankur JAIN ,  Paras S. DOSHI

IPC: F28D15/02 ,  B23P15/26

CPC classification number: F28D15/02 ,  F28D2021/0028 ,  G06F1/203 ,  G06F2200/201 ,  H05K7/2029 ,  Y10T29/49359

Abstract: An apparatus for managing heat generated by at least one electronic component of a mobile device, the apparatus comprising: a housing for containing the electronic component of the mobile device; and a vapor chamber arranged in the housing, the vapor chamber having a cavity defined by a front wall and a rear wall opposite the rear wall, the front wall for receiving heat generated by the electronic component of the mobile device to evaporate fluid in the cavity into a vapor, the rear wall for receiving the vapor to allow the vapor to condense to liquid thereby cooling the rear wall of the vapor chamber; wherein an outer surface of the housing comprises at least a portion of the rear wall of the vapor chamber.

Abstract translation: 一种用于管理移动装置的至少一个电子部件产生的热量的装置，所述装置包括：用于容纳移动装置的电子部件的壳体; 以及布置在所述壳体中的蒸气室，所述蒸气室具有由前壁和与所述后壁相对的后壁限定的空腔，所述前壁用于接收由所述移动装置的电子部件产生的热量以使所述空腔中的流体蒸发 蒸汽，用于接收蒸汽的后壁，以允许蒸气冷凝至液体，从而冷却蒸气室的后壁; 其中壳体的外表面包括蒸气室的后壁的至少一部分。