公开(公告)号：US20220364864A1

公开(公告)日：2022-11-17

申请号：US17774381

申请日：2020-11-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hideki UEDA ,  Yusuke NAKAMURA ,  Koichiro NAKASHIMA ,  Takashi UCHIDA ,  Toshio YAMAZAKI ,  Hiroyuki FUJII ,  Chikara NARA

IPC: G01C19/5783 ,  B81B7/00

Abstract: A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.

公开(公告)号：US20230076794A1

公开(公告)日：2023-03-09

申请号：US17882309

申请日：2022-08-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hideki UEDA ,  Koichiro NAKASHIMA

IPC: G01P3/483

Abstract: A sensor device includes a conductive layer. The conductive layer is interposed between a first principal surface of an IC chip and a sensor element and faces the sensor element via a resin-based adhesive layer. The sensor element includes: a moving part including a moving electrode; a fixed part including a fixed electrode forming capacitance between the moving electrode and itself; a first terminal connected to the moving electrode; and a second terminal connected to the fixed electrode. The IC chip includes: a signal processor that processes a detection signal from the second terminal; a first voltage generator that generates a first voltage as an operating voltage for the processor; and a second voltage generator that generates a second voltage corresponding to the sensor element's reference potential applied to the first terminal. The conductive layer is electrically connected to the first terminal.

公开(公告)号：US20220057211A1

公开(公告)日：2022-02-24

申请号：US17415340

申请日：2020-02-04

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Koichiro NAKASHIMA ,  Takashi UCHIDA ,  Yusuke NAKAMURA ,  Hideki UEDA ,  Naruhito NODA ,  Toshitsugu KONISHI ,  Toshio YAMAZAKI

IPC: G01C19/5783 ,  G01C19/5684 ,  B81B7/00

Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.