公开(公告)号：US20220057211A1

公开(公告)日：2022-02-24

申请号：US17415340

申请日：2020-02-04

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Koichiro NAKASHIMA ,  Takashi UCHIDA ,  Yusuke NAKAMURA ,  Hideki UEDA ,  Naruhito NODA ,  Toshitsugu KONISHI ,  Toshio YAMAZAKI

IPC: G01C19/5783 ,  G01C19/5684 ,  B81B7/00

Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.