STRESS MONITORING OF 3D-PRINTED BUILDING STRUCTURES

    公开(公告)号:US20230036241A1

    公开(公告)日:2023-02-02

    申请号:US17390493

    申请日:2021-07-30

    IPC分类号: B29C64/106 G01L5/1627

    摘要: Systems and methods for monitoring stress in 3D-printed building structures using embedded and surface sensors. The sensors may be embedded during or after the 3D printing process. The sensors may be strain gauges integrally formed in the 3D-printed building structure or positioned on the surface of the 3D-printed building structure. The embedded and surface sensors may measure tensile and compressive deformation occurring during the printing process, material relaxation process, the transportation process, and at a final location of the 3D-printed building structure. Deformation data collected by the sensors may be compared to accepted threshold values based on the material of the 3D-printed building structure.

    Stress monitoring of 3D-printed building structures

    公开(公告)号:US11654611B2

    公开(公告)日:2023-05-23

    申请号:US17390493

    申请日:2021-07-30

    摘要: Systems and methods for monitoring stress in 3D-printed building structures using embedded and surface sensors. The sensors may be embedded during or after the 3D printing process. The sensors may be strain gauges integrally formed in the 3D-printed building structure or positioned on the surface of the 3D-printed building structure. The embedded and surface sensors may measure tensile and compressive deformation occurring during the printing process, material relaxation process, the transportation process, and at a final location of the 3D-printed building structure. Deformation data collected by the sensors may be compared to accepted threshold values based on the material of the 3D-printed building structure.