公开(公告)号：US20230215797A1

公开(公告)日：2023-07-06

申请号：US18076373

申请日：2022-12-06

Applicant: MEDIATEK INC.

Inventor： Hui-Chi Tang ,  Hsuan-Yi Lin ,  Shao-Chun Ho ,  Yi-Wen Chiang ,  Pu-Shan Huang

IPC: H01L23/498 ,  H05K1/11

CPC classification number: H01L23/49838 ,  H01L23/49811 ,  H05K1/111 ,  H05K2201/094

Abstract: A board-level pad pattern includes staggered ball pads disposed within a surface mount region for mounting a multi-row QFN package. The staggered ball pads include first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at two different pitches, and the second ball pads in the second row are arranged at a constant pitch.