公开(公告)号：US10103418B2

公开(公告)日：2018-10-16

申请号：US15043288

申请日：2016-02-12

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Hyo Hoon Park ,  Hyeon Min Bae ,  Tae Woo Lee

IPC: H01P3/12 ,  H01P5/107 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P11/00 ,  H01P1/04 ,  H05K1/02

Abstract: Disclosed is a printed-circuit board (PCB) structure having an electromagnetic-tunnel-embedded architecture, the PCB structure including a PCB, and an EM-tunnel-embedded in the PCB, wherein the EM-tunnel includes a dielectric core and a metal clad which surrounds the dielectric core and has at least one port exposed to a surface of the PCB.

公开(公告)号：US20170207510A1

公开(公告)日：2017-07-20

申请号：US15043288

申请日：2016-02-12

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Hyo Hoon Park ,  Hyeon Min Bae ,  Tae Woo Lee

IPC: H01P5/107 ,  H01P5/08 ,  H05K1/02 ,  H01P11/00 ,  H01P3/16 ,  H01P5/02

CPC classification number: H01P3/165 ,  H01P1/042 ,  H01P3/122 ,  H01P5/02 ,  H01P5/087 ,  H01P5/107 ,  H01P11/001 ,  H01P11/006 ,  H05K1/0243

Abstract: Disclosed is a printed-circuit board (PCB) structure having an electromagnetic-tunnel-embedded architecture, the PCB structure including a PCB, and an EM-tunnel-embedded in the PCB, wherein the EM-tunnel includes a dielectric core and a metal clad which surrounds the dielectric core and has at least one port exposed to a surface of the PCB.