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公开(公告)号:US20240258445A1
公开(公告)日:2024-08-01
申请号:US18034591
申请日:2020-10-30
Inventor: Sung-Yool Choi , Hyeok Jun Jin , Khang June Lee
IPC: H01L31/032 , H01L31/109 , H01L31/18
CPC classification number: H01L31/032 , H01L31/109 , H01L31/18
Abstract: The present invention relates to an optical sensor using ferroelectrics, including a substrate; a first type semiconductor stacked on the substrate; and a second type semiconductor in contact with the first type semiconductor to form a heterojunction structure, wherein at least one of the first type semiconductor or the second type semiconductor is ferroelectrics.
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公开(公告)号:US11552267B2
公开(公告)日:2023-01-10
申请号:US16941891
申请日:2020-07-29
Inventor: Sung-Yool Choi , Byung Chul Jang , Jun Hwe Cha
Abstract: The present disclosure provides a soft memristor for soft neuromorphic system including a substrate, a first electrode layer formed on the substrate, a metal diffusion barrier layer formed on the first electrode layer, a resistive switching material layer formed on the metal diffusion barrier layer, and a second electrode layer formed on the resistive switching material layer.
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公开(公告)号:US20210143349A1
公开(公告)日:2021-05-13
申请号:US16941891
申请日:2020-07-29
Inventor: Sung-Yool Choi , Byung Chul Jang , Jun Hwe Cha
Abstract: The present disclosure provides a soft memristor for soft neuromorphic system including a substrate, a first electrode layer formed on the substrate, a metal diffusion barrier layer formed on the first electrode layer, a resistive switching material layer formed on the metal diffusion barrier layer, and a second electrode layer formed on the resistive switching material layer.
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公开(公告)号:US11793006B2
公开(公告)日:2023-10-17
申请号:US17394276
申请日:2021-08-04
Inventor: Sangsu Park , Sung-Yool Choi , Sung Gap Im , Sang Yoon Yang , Jungyeop Oh
CPC classification number: H10K10/50 , G06N3/065 , H10K10/82 , H10K19/202 , H10K71/10 , H10K85/111 , H10K85/151
Abstract: Disclosed are a memristor device, a method of fabricating the same, a synaptic device including a memristor device, and a neuromorphic device including a synaptic device. The disclosed memristor device may comprise a first electrode, a second electrode disposed to be spaced apart from the first electrode; and a resistance changing layer including a copolymer between the first electrode and the second electrode. The copolymer may be a copolymer of a first monomer and a second monomer, and the first polymer formed from the first monomer may have a property that diffusion of metal ions is faster than that of the second polymer formed from the second monomer. The second polymer may have a lower diffusivity of metal ions as compared with the first polymer. The first monomer may include vinylimidazole (VI). The second monomer may include 1,3,5-trivinyl-1,3,5-trimethylcyclotrisiloxane (V3D3). The copolymer may include p(V3D3-co-VI).
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公开(公告)号:US11268210B2
公开(公告)日:2022-03-08
申请号:US16925674
申请日:2020-07-10
Inventor: Sung-Yool Choi , Woonggi Hong , Gi Woong Shim
Abstract: The present disclosure provides a method for preparing a transition metal chalcogenide including: a step of forming a transition metal chalcogenide thin film; and a step of controlling the defects of the transition metal chalcogenide thin film by injecting a processing gas including oxygen and nitrogen to the formed transition metal chalcogenide thin film.
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公开(公告)号:US20220010456A1
公开(公告)日:2022-01-13
申请号:US16925674
申请日:2020-07-10
Inventor: Sung-Yool Choi , Woonggi Hong , Gi Woong Shim
Abstract: The present disclosure provides a method for preparing a transition metal chalcogenide including: a step of forming a transition metal chalcogenide thin film; and a step of controlling the defects of the transition metal chalcogenide thin film by injecting a processing gas including oxygen and nitrogen to the formed transition metal chalcogenide thin film.
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公开(公告)号:US11024759B2
公开(公告)日:2021-06-01
申请号:US16226950
申请日:2018-12-20
Inventor: Sung-Yool Choi , Gwang Hyuk Shin
IPC: H01L31/0336 , H01L31/10 , H01L29/24 , H01L29/778
Abstract: Provided is an electronic device containing: a two-dimensional semiconductor material; and another heterogeneous material adjacent to the two-dimensional semiconductor material, wherein the heterogeneous material is doped with an impurity of a type different from the two-dimensional semiconductor material or has a band gap different from the two-dimensional semiconductor material.
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