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公开(公告)号：US20200274222A1
公开(公告)日：2020-08-27
申请号：US16874213
申请日：2020-05-14
Inventor： Hyeon Min BAE , Ha II SONG , Huxian JIN
Abstract: Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.
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2.发明申请Low Power, High Speed Multi-Channel Chip-to-Chip Interface using Dielectric Waveguide 有权使用介质波导的低功耗，高速多通道芯片到芯片接口公开(公告)号：US20140184351A1
公开(公告)日：2014-07-03
申请号：US14103005
申请日：2013-12-11
Inventor： Hyeon Min BAE , Ha Il SONG , Huxian JIN
Abstract: An exemplary embodiment of the present invention provides an improved dielectric waveguide named electrical fiber. The electrical fiber with a metal cladding may isolate the interference of the signals in other wireless channels and adjacent electrical fibers, which typically causes band-limitation problem, for a smaller radiation loss and better signal guiding to lower the total transceiver power consumption as the transmit distance increases. Also, the electrical fiber may have frequency independent attenuation characteristics to enable high data rate transfer with little or even without any additional receiver-side compensation due to vertical coupling of the electrical fiber and an interconnection device.
Abstract translation: 本发明的示例性实施例提供了一种改进的电介质波导，称为电光纤。 具有金属覆层的电光纤可以隔离其它无线信道和相邻电缆中的信号的干扰，这通常导致带限问题，以减小辐射损耗，并且更好的信号导向以降低总的收发机功率消耗，因为传输 距离增加。 此外，电光纤可以具有频率独立的衰减特性，以便由于电光纤和互连设备的垂直耦合而很少或甚至没有任何额外的接收器侧补偿来实现高数据速率传输。
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