公开(公告)号：US10801953B2

公开(公告)日：2020-10-13

申请号：US16245695

申请日：2019-01-11

Applicant: KLA-Tencor Corporation

Inventor： David Y. Wang ,  Alexander Buettner ,  Stilian Ivanov Pandev ,  Emanuel Saerchen ,  Andrei V. Shchegrov ,  Barry Blasenheim

IPC: G01J3/28 ,  G01N21/3563 ,  H01L21/66 ,  G01N21/21

Abstract: Methods and systems for performing semiconductor measurements based on hyperspectral imaging are presented herein. A hyperspectral imaging system images a wafer over a large field of view with high pixel density over a broad range of wavelengths. Image signals collected from a measurement area are detected at a number of pixels. The detected image signals from each pixel are spectrally analyzed separately. In some embodiments, the illumination and collection optics of a hyperspectral imaging system include fiber optical elements to direct illumination light from the illumination source to the measurement area on the surface of the specimen under measurement and fiber optical elements to image the measurement area. In another aspect, a fiber optics collector includes an image pixel mapper that couples a two dimensional array of collection fiber optical elements into a one dimensional array of pixels at the spectrometer and the hyperspectral detector.

公开(公告)号：US20200225151A1

公开(公告)日：2020-07-16

申请号：US16245695

申请日：2019-01-11

Applicant: KLA-Tencor Corporation

Inventor： David Y. Wang ,  Alexander Buettner ,  Stilian Ivanov Pandev ,  Emanuel Saerchen ,  Andrei V. Shchegrov ,  Barry Blasenheim

IPC: G01N21/3563 ,  G01J3/28 ,  H01L21/66 ,  G01N21/21

Abstract: Methods and systems for performing semiconductor measurements based on hyperspectral imaging are presented herein. A hyperspectral imaging system images a wafer over a large field of view with high pixel density over a broad range of wavelengths. Image signals collected from a measurement area are detected at a number of pixels. The detected image signals from each pixel are spectrally analyzed separately. In some embodiments, the illumination and collection optics of a hyperspectral imaging system include fiber optical elements to direct illumination light from the illumination source to the measurement area on the surface of the specimen under measurement and fiber optical elements to image the measurement area. In another aspect, a fiber optics collector includes an image pixel mapper that couples a two dimensional array of collection fiber optical elements into a one dimensional array of pixels at the spectrometer and the hyperspectral detector.