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1.发明授权公开(公告)号：US10127652B2
公开(公告)日：2018-11-13
申请号：US14612192
申请日：2015-02-02
Applicant: KLA-Tencor Corporation
Inventor： Lisheng Gao , Avijit K. Ray-Chaudhuri , Raghav Babulnath , Kenong Wu
Abstract: Systems and methods for classifying defects detected on a wafer are provided. One method includes detecting defects on a wafer based on output generated for the wafer by an inspection system. The method also includes determining one or more attributes for at least one of the defects based on portions of a standard reference image corresponding to the at least one of the defects. The method further includes classifying the at least one of the defects based at least in part on the one or more determined attributes.
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2.发明申请DEFECT DETECTION AND CLASSIFICATION BASED ON ATTRIBUTES DETERMINED FROM A STANDARD REFERENCE IMAGE 审中-公开基于标准参考图像确定的属性的缺陷检测和分类公开(公告)号：US20150221076A1
公开(公告)日：2015-08-06
申请号：US14612192
申请日：2015-02-02
Applicant: KLA-Tencor Corporation
Inventor： Lisheng Gao , Avijit K. Ray-Chaudhuri , Raghav Babulnath , Kenong Wu
CPC classification number: G06T7/001 , G06T2207/10024 , G06T2207/10061 , G06T2207/30148
Abstract: Systems and methods for classifying defects detected on a wafer are provided. One method includes detecting defects on a wafer based on output generated for the wafer by an inspection system. The method also includes determining one or more attributes for at least one of the defects based on portions of a standard reference image corresponding to the at least one of the defects. The method further includes classifying the at least one of the defects based at least in part on the one or more determined attributes.
Abstract translation: 提供了用于对在晶片上检测到的缺陷进行分类的系统和方法。 一种方法包括基于通过检查系统为晶片产生的输出来检测晶片上的缺陷。 该方法还包括基于对应于至少一个缺陷的标准参考图像的部分来确定至少一个缺陷的一个或多个属性。 该方法还包括至少部分地基于一个或多个确定的属性来对至少一个缺陷进行分类。
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