Tunable diode laser absorption spectroscopy with corrected laser ramping nonlinearities

    公开(公告)号:US10677726B2

    公开(公告)日:2020-06-09

    申请号:US15846912

    申请日:2017-12-19

    摘要: A tunable diode laser absorption spectroscopy device includes a tunable diode laser. A laser driver is configured to drive the diode laser and ramp it within a particular frequency range. An analyte gas container, a reference gas container, and a fringe generating device are configured to receive the laser therethrough. An optical detector is configured to detect the laser after it has passed through the analyte gas container and/or the reference gas container, and the in-line fringe generating device. An acquisition card is configured to sample an output of the optical detector. A spectral analyzer is configured to receive output data from the acquisition card, determine a spectrum of the output data, decouple the fringe spectrum from the measured spectrum, calibrate the spectrum based on an expected ideal spectrum of both the fringe and reference gas, and determine a composition of the analyte based on the calibrated spectrum.

    SINGLE EDGE COUPLING OF CHIPS WITH INTEGRATED WAVEGUIDES

    公开(公告)号:US20190391330A1

    公开(公告)日:2019-12-26

    申请号:US16445623

    申请日:2019-06-19

    IPC分类号: G02B6/12 G02B6/124 G02B6/125

    摘要: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

    SINGLE EDGE COUPLING OF CHIPS WITH INTEGRATED WAVEGUIDES

    公开(公告)号:US20190391329A1

    公开(公告)日:2019-12-26

    申请号:US16270886

    申请日:2019-02-08

    IPC分类号: G02B6/12 G02B6/125 G02B6/124

    摘要: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.

    HOUSING APPARATUS FOR SENSITIVE GAS SENSOR
    7.
    发明申请

    公开(公告)号:US20200209148A1

    公开(公告)日:2020-07-02

    申请号:US16732511

    申请日:2020-01-02

    IPC分类号: G01N21/17 G01N21/39

    摘要: A sensor housing apparatus includes a housing having an enclosure and outer assembly, at least one flow path extending through the housing, a gas sensor disposed in the enclosure and a thermal mass. The thermal mass is mounted within the enclosure in thermal communication with the gas sensor, and is configured to transfer thermal energy from the gas sensor to an ambient environment surrounding the housing and minimize temperature gradients adjacent the gas sensor.

    Single edge coupling of chips with integrated waveguides

    公开(公告)号:US10901146B2

    公开(公告)日:2021-01-26

    申请号:US16445623

    申请日:2019-06-19

    摘要: Techniques are provided for single edge coupling of chips with integrated waveguides. For example, a package structure includes a first chip with a first critical edge, and a second chip with a second critical edge. The first and second chips include integrated waveguides with end portions that terminate on the first and second critical edges. The second chip includes a signal reflection structure that is configured to reflect an optical signal propagating in one or more of the integrated waveguides of the second chip. The first and second chips are edge-coupled at the first and second critical edges such that the end portions of the integrated waveguides of the first and second chips are aligned to each other, and wherein all signal input/output between the first and second chips occurs at the single edge-coupled interface.