公开(公告)号：US20230194809A1

公开(公告)日：2023-06-22

申请号：US17556326

申请日：2021-12-20

Applicant: Intel Corporation

Inventor： Divya Pratap

IPC: G02B6/42

CPC classification number: G02B6/4253 ,  G02B6/4261 ,  G02B6/4245

Abstract: A fluid compatible electro-optical packages and associated systems and devices are shown. For example, a fluid compatible electro-optical package includes integrated circuits with at least one photonic die and optical connections coupled with the integrated circuit. In an example, optical fibers are coupled with the optical connection. In an example fluid compatible electro-optical package, a fluid impermeable port is coupled with the optical connection and the optical fibers couple with the optical connection within the fluid impermeable port.

公开(公告)号：US11029756B2

公开(公告)日：2021-06-08

申请号：US15870737

申请日：2018-01-12

Applicant: Intel Corporation

Inventor： Richmond F. Hicks ,  Khaled Ahmed ,  Divya Pratap

IPC: G06F3/01 ,  G09G3/20 ,  G09G3/32

Abstract: In some examples, a display includes a plurality of display pixels. Each display pixel includes one or more light emitters. At least some of the plurality of display pixels also includes a light detector.

公开(公告)号：US12174436B2

公开(公告)日：2024-12-24

申请号：US17214035

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Wesley Morgan ,  Srikant Nekkanty ,  Todd R. Coons ,  Gregorio R. Murtagian ,  Xiaoqian Li ,  Nitin Deshpande ,  Divya Pratap

IPC: H04B10/00 ,  G02B6/42

Abstract: Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

公开(公告)号：US12153269B2

公开(公告)日：2024-11-26

申请号：US17132955

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Divya Pratap ,  Srikant Nekkanty

IPC: H04B10/00 ,  G02B6/42 ,  H01L23/538

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical couplers that provide optical coupling at or proximate to an edge of a silicon photonics package, to allow the package to optically couple with other devices or peripherals. In embodiments, the active optical coupler is optically coupled with a photonics IC (PIC) inside the photonics package, and provides an optical coupling mechanism for optical pathways outside the photonics package. The active optical coupler may include electrical circuitry and may be coupled to the package substrate to provide data related to the operation of the active optical coupler. Other embodiments may be described and/or claimed.

公开(公告)号：US20230023483A1

公开(公告)日：2023-01-26

申请号：US17954172

申请日：2022-09-27

Applicant: Intel Corporation

Inventor： Wesley Morgan ,  Feifei Cheng ,  Divya Pratap

IPC: G02B6/38

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to enable customization of pigtail lengths of optical connectors. Disclosed is an apparatus comprising an affixed fiber array unit plug including a first optical fiber, a detachable fiber array unit plug including a second optical fiber, the detachable fiber array unit plug to be removably coupled to the affixed fiber array unit plug, and guide pins to interface with both the detachable fiber array unit plug and the affixed fiber array unit plug when coupled together, the guide pins to facilitate alignment of the first optical fiber with the second optical fiber.