公开(公告)号：US20240030830A1

公开(公告)日：2024-01-25

申请号：US18477250

申请日：2023-09-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD. ,  FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E.V.

Inventor： Haitao Chen ,  Zhixiang Hu ,  Xingzhong Zhang ,  Peng Shuai ,  Eckart Hoene

IPC: H02M7/219 ,  H02M3/335 ,  B60L53/22

CPC classification number: H02M7/219 ,  H02M3/33573 ,  B60L53/22 ,  H02J2310/48 ,  H02J9/06

Abstract: The present disclosure refers to an alternating current/direct current (AC/DC) converter for an on board charger (OBC). The AC/DC converter includes a three-phase-input comprising three inputs, a single-stage dual-active bridge (DAB) circuit, and an auxiliary circuit. The auxiliary circuit includes two switching means and an energy storage means, the auxiliary circuit also includes at least two branches, wherein each of the at least two branches include one of the switching means. At least one branch of the at least two branches is connected to a single-phase AC input of the three inputs, and another branch of the at least two branches is connected to an input of the three inputs which is not a single-phase AC input, and the another branch comprises the energy storage means.

公开(公告)号：US11641072B2

公开(公告)日：2023-05-02

申请号：US17327297

申请日：2021-05-21

Applicant: Huawei Technologies Co., Ltd.

Inventor： Weijian Pan ,  Zhixiang Hu ,  Dan Yang

IPC: H01R12/00 ,  H01R12/70 ,  H01R12/73 ,  H05K3/00 ,  H05K3/04

Abstract: This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.