公开(公告)号：US20200161766A1

公开(公告)日：2020-05-21

申请号：US16685621

申请日：2019-11-15

Applicant: Huawei Technologies Co., Ltd.

Inventor： Liangsheng LIU ,  Xinhong LI ,  HuiLi FU

IPC: H01Q9/04 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q23/00 ,  H01Q13/10

Abstract: The disclosure discloses an antenna-in-package structure, including a first substrate and a second substrate. A first surface of the first substrate includes a first patch antenna, the second substrate is connected to a second surface of the first substrate, and the second substrate is provided with a third surface and a fourth surface. The third surface includes a second patch antenna, and a projection of the second patch antenna on the first surface at least partially overlaps the first patch antenna. A cavity is disposed between the first substrate and the second substrate, and the second patch antenna is separated from the second surface by the cavity. The fourth surface includes a radio frequency element, and the radio frequency element sends and receives a radio frequency signal by using the first patch antenna and the second patch antenna.