公开(公告)号：US11862529B2

公开(公告)日：2024-01-02

申请号：US17473673

申请日：2021-09-13

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun Deng ,  Xiaoyun Wei ,  Yong Yang ,  Jiye Xu ,  Xing Fu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/367 ,  H01L23/49827 ,  H01L24/08 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05684 ,  H01L2224/08233

Abstract: Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.