公开(公告)号：US20240235689A1

公开(公告)日：2024-07-11

申请号：US18611687

申请日：2024-03-20

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chengcheng Gui ,  Cheng Zeng ,  Jinsong Xia ,  Xiaolu Song

IPC: H04B10/50

CPC classification number: H04B10/5051 ,  H04B10/50597

Abstract: An optical signal sending apparatus includes an optical modulator, a differential driver, and a phase modulator. The optical modulator includes an optical input end, a first modulation region, a connection region, a second modulation region, and an optical output end. The first modulation region includes a first modulation arm and a second modulation arm. The second modulation region includes a third modulation arm and a fourth modulation arm. Each modulation arm includes an optical waveguide and electrodes on two sides of the optical waveguide. A differential drive signal is used to drive the two modulation regions, so that photoelectric signal modulation is implemented. The modulation arms are arranged in a stacked manner, so that a size of the optical modulator can be greatly reduced, thereby facilitating miniaturization.

公开(公告)号：US20240272367A1

公开(公告)日：2024-08-15

申请号：US18592477

申请日：2024-02-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chengcheng Gui ,  Cheng Zeng ,  Jinsong Xia ,  Xiaolu Song

IPC: G02B6/30

CPC classification number: G02B6/305

Abstract: An optical coupler for use in optical communication includes a buried layer, a support layer, a waveguide layer, and an upper cladding layer. In a height direction, the support layer is located between the buried layer and the waveguide layer, and the waveguide layer is located between the support layer and the upper cladding layer. In a width direction, the waveguide layer and the support layer are located inside the upper cladding layer. A material of the waveguide layer is different from a material of the support layer. The support layer is located inside the upper cladding layer such that two sides of the support layer include the upper cladding layer.

公开(公告)号：US10466297B2

公开(公告)日：2019-11-05

申请号：US15663002

申请日：2017-07-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jianping Deng ,  Cheng Zeng ,  Qingsong Zhu

IPC: G01R31/08 ,  G01R31/28 ,  G01B7/16 ,  G01R27/08 ,  G01R31/3183

Abstract: An integrated circuit detection method, apparatus, and system are disclosed, which relate to the field of electronics and resolve a problem of detecting an electrical parameter of an integrated circuit on a printed circuit board in a power-on state. A specific solution is as follows: N detection circuits (101) are disposed, where each detection circuit (101) is connected to a different integrated circuit (102), the detection circuit (101) is provided with a first detection point (a) and a second detection point (b), and the detection circuit (101) is configured to detect the electrical parameter of the integrated circuit (102) that is connected to the detection circuit (101); and N is an integer greater than or equal to 1. The solution is used in a process of detecting the electrical parameter of the integrated circuit on the printed circuit board.