公开(公告)号：US20180224815A1

公开(公告)日：2018-08-09

申请号：US15949612

申请日：2018-04-10

Applicant: Flextronics AP, LLC

Inventor： Raymundo Alatorre Mercado ,  Murad Kurwa ,  Gervasio Mutarelli ,  Xiuchuan Wang

IPC: G05B19/00 ,  B25J15/04 ,  H05K3/00

CPC classification number: G05B19/00 ,  B25J11/00 ,  B25J15/04 ,  H05K3/0005 ,  H05K3/0008

Abstract: A method and apparatus for generating consumer electronics using a Universal Box Build (UBB) are disclosed herein. The method may include entering specifications of a product comprised of a printed circuit board (PCB), additional components (such as Central Processing Units (CPUs), memory modules, and heatsinks) into a chassis module, inserting a set of required components in the UBB, and generating the PCB assembly based on the entered specifications, wherein a robot is operatively connected to the interface module to automatically generate a product assembly.

公开(公告)号：US09566764B1

公开(公告)日：2017-02-14

申请号：US14579631

申请日：2014-12-22

Applicant: Flextronics AP, LLC

Inventor： Anwar Mohammed ,  Weifeng Liu ,  David Geiger ,  Dennis Willie ,  Gervasio Mutarelli ,  Murad Kurwa

IPC: B32B3/00 ,  B32B7/14 ,  B32B37/12 ,  B32B37/16 ,  B32B37/06 ,  H05K3/36 ,  H05K1/11

CPC classification number: B32B7/14 ,  B32B7/12 ,  B32B9/005 ,  B32B9/04 ,  B32B9/045 ,  B32B27/08 ,  B32B37/06 ,  B32B37/1207 ,  B32B37/18 ,  B32B2255/26 ,  B32B2307/202 ,  B32B2309/02 ,  B32B2363/00 ,  B32B2457/00 ,  B32B2457/08 ,  F16B11/006 ,  H05K3/305 ,  H05K3/321 ,  H05K3/36

Abstract: Two substrates are mechanically and electrically coupled together using a combination of a fast cure electrically non-conductive epoxy for mechanical attachment and a slow cure electrically conductive epoxy for electrical interconnects. The two epoxies are selectively applied between the two substrates as a stack, and the stack is subjected to a temperature that is sufficient to cure the fast cure electrically non-conductive epoxy in a short period of time but does not damage the substrates or components coupled thereto. In some applications, the temperature is less than 100 degrees Celsius and the time period is less than 5 seconds. The stack is removed from the heat and the slow cure electrically conductive epoxy continues to cure over a longer second period of time, such as a few hours to a day.

Abstract translation: 使用用于机械附接的快速固化非导电环氧树脂和用于电互连的缓慢固化导电环氧树脂的组合将两个基底机械和电耦合在一起。 两个环氧树脂作为叠层选择性地施加在两个基板之间，并且堆叠体经历足够的温度以在短时间段内固化快速固化的非导电环氧树脂，但不会损坏耦合的基板或部件 到此。 在一些应用中，温度低于100摄氏度，时间段小于5秒。 堆叠从热量中除去，慢固化导电环氧树脂在更长的第二时间段内继续固化，例如几小时至一天。

公开(公告)号：US20160286663A1

公开(公告)日：2016-09-29

申请号：US14666470

申请日：2015-03-24

Applicant: Flextronics AP, LLC

Inventor： Raymundo Alatorre Mercado ,  Murad Kurwa ,  Gervasio Mutarelli ,  Xiuchuan Wang

IPC: H05K3/30

CPC classification number: G05B19/00 ,  B25J11/00 ,  B25J15/04 ,  H05K3/0005 ,  H05K3/0008

Abstract: A method and apparatus for generating consumer electronics using a Universal Box Build (UBB) are disclosed herein. The method may include entering specifications of a product comprised of a printed circuit board (PCB), additional components (such as Central Processing Units (CPUs), memory modules, and heatsinks) into a chassis module, inserting a set of required components in the UBB, and generating the PCB assembly based on the entered specifications, wherein a robot is operatively connected to the interface module to automatically generate a product assembly.

Abstract translation: 本文公开了使用通用盒构建（UBB）来生成消费电子产品的方法和装置。 该方法可以包括将包括印刷电路板（PCB），附加组件（例如中央处理单元（CPU），存储器模块和散热器）的产品的规格输入到机箱模块中，将一组所需组件插入到 UBB，以及基于输入的规格生成PCB组件，其中机器人可操作地连接到接口模块以自动生成产品组件。

公开(公告)号：US09958847B2

公开(公告)日：2018-05-01

申请号：US14666470

申请日：2015-03-24

Applicant: Flextronics AP, LLC

Inventor： Raymundo Alatorre Mercado ,  Murad Kurwa ,  Gervasio Mutarelli ,  Xiuchuan Wang

IPC: G05B19/00 ,  H05K3/00 ,  B25J15/04

CPC classification number: G05B19/00 ,  B25J11/00 ,  B25J15/04 ,  H05K3/0005 ,  H05K3/0008

Abstract: A method and apparatus for generating consumer electronics using a Universal Box Build (UBB) are disclosed herein. The method may include entering specifications of a product comprised of a printed circuit board (PCB), additional components (such as Central Processing Units (CPUs), memory modules, and heatsinks) into a chassis module, inserting a set of required components in the UBB, and generating the PCB assembly based on the entered specifications, wherein a robot is operatively connected to the interface module to automatically generate a product assembly.