公开(公告)号：US12142578B2

公开(公告)日：2024-11-12

申请号：US17492836

申请日：2021-10-04

Applicant: Cisco Technology, Inc.

Inventor： Xiaohong Wu ,  Xing Wang ,  Mike Sapozhnikov ,  Sayed Ashraf Mamun ,  Tomer Osi ,  Joel Goergen

IPC: H01L23/50 ,  H01L23/00 ,  H01L23/053 ,  H01R12/00 ,  H05K1/18 ,  H05K7/10

Abstract: An apparatus includes a printed circuit board (PCB), and an integrated circuit (IC) package connected with the PCB. The IC package includes a package substrate, a die secured to the package substrate and including an integrated circuit, and a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die. The stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, where the stiffener ring includes a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer.

公开(公告)号：US11894296B2

公开(公告)日：2024-02-06

申请号：US17446729

申请日：2021-09-02

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Sayed Ashraf Mamun ,  Tomer Osi ,  Amendra Koul ,  David Nozadze ,  Upendranadh R. Kareti ,  Joel R. Goergen

IPC: H01L23/50 ,  H01L23/367 ,  H01L23/498 ,  H05K7/20

CPC classification number: H01L23/50 ,  H01L23/3672 ,  H01L23/49838 ,  H05K7/209

Abstract: An apparatus includes an integrated circuit package and a heatsink. The integrated circuit package includes a substrate, an integrated circuit, a first plurality of signal conductors, and a second plurality of signal conductors. The substrate includes a first surface and a second surface opposite the first surface. The integrated circuit is coupled to the first surface of the substrate. The first plurality of signal conductors are arranged along a periphery of the first surface of the substrate. The second plurality of signal conductors are arranged along a periphery of the second surface of the substrate. The heatsink includes a first portion positioned along the first surface of the substrate and a second portion positioned along the second surface of the substrate.

公开(公告)号：US11777239B2

公开(公告)日：2023-10-03

申请号：US17653466

申请日：2022-03-04

Applicant: Cisco Technology, Inc.

Inventor： Mike Sapozhnikov ,  Sayed Ashraf Mamun ,  Tomer Osi ,  Amendra Koul ,  David Nozadze ,  Upendranadh R. Kareti ,  Joel R. Goergen

IPC: H01R12/75 ,  H01R12/72

CPC classification number: H01R12/727 ,  H01R12/75

Abstract: Certain aspects of the present disclosure provide techniques for pinless interconnect for twinaxial cables to an IC. This includes a socket coupled to an integrated circuit (IC), a port structure coupled to the socket, and a ground connector inserted into the port structure. It further includes a twinaxial cable including a pair of conductors inserted through the ground connector to establish an electrical connection between the twinaxial cable and the IC.