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公开(公告)号:US20240162613A1
公开(公告)日:2024-05-16
申请号:US18123518
申请日:2023-03-20
Applicant: Chengdu Tianma Micro-Electronics Co.,Ltd.
Inventor: Puxiang TANG , Dengming LEI , Zhenyu JIA , Kerui XI , Baiquan LIN , Zuocai YANG , Qinyi DUAN , Yifan BAO
CPC classification number: H01Q9/0407 , H01Q3/36
Abstract: Antenna and communication device are provided. The antenna includes a first substrate, a second substrate that are oppositely arranged and a dielectric function layer arranged between the first substrate and the second substrate; a ground layer, arranged on a side of the dielectric functional layer away from the first substrate; a radiation layer, arranged on a side of the dielectric functional layer away from the second substrate, and including a plurality of radiation units, a radiation unit of the plurality of radiation units including a radiation patch and a phase shifter surrounding the radiation patch, and the radiation patch being insulated from the phase shifter; and a wiring layer, arranged on a side of the dielectric functional layer away from the second substrate, including a plurality of first signal lines, and different phase shifters being electrically connected to different first signal lines.
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公开(公告)号:US20240250425A1
公开(公告)日:2024-07-25
申请号:US18135940
申请日:2023-04-18
Applicant: Chengdu Tianma Micro-Electronics Co.,Ltd.
Inventor: Yifan XING , Zhenyu JIA , Baiquan LIN , Kerui XI , Xiaonan HAN , Qingsan ZHU , Ping SU , Yifan BAO , Zuocai YANG , Yi WANG
CPC classification number: H01Q15/0066 , H01Q3/44
Abstract: A liquid crystal phase shifter and a liquid crystal antenna are provided. The liquid crystal phase shifter includes a first substrate and a second substrate oppositely disposed; a liquid crystal layer disposed between the first substrate and the second substrate; a radio frequency connector; and a driving chip. A side of the second substrate adjacent to the first substrate includes a first conductive layer connected to a constant potential; a side of the first substrate adjacent to the second substrate includes a second conductive layer including a transmission electrode; the first substrate includes a first area bonded with a circuit board; and the radio frequency connector and the driving chip are both disposed in the first area and transmit signals through the circuit board.
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