METHODS AND OPTICAL ASSEMBLIES FOR HIGH ANGLE LASER PROCESSING OF TRANSPARENT WORKPIECES

    公开(公告)号:US20220073401A1

    公开(公告)日:2022-03-10

    申请号:US17407824

    申请日:2021-08-20

    Abstract: A method for processing a transparent workpiece includes directing a laser beam oriented along a beam pathway through an aspheric optical element and the transparent workpiece. The laser beam impinges the aspheric optical element radially offset from a centerline axis of the aspheric optical element by an offset distance of 30% the 1/e2 diameter of the laser beam or greater. The beam pathway and the transparent workpiece are tilted relative to one another such that the beam pathway has a beam pathway angle of less than 90° relative to an impingement surface at the impingement surface and a portion of the laser beam directed into the transparent workpiece is a laser beam focal line having an internal focal line angle of less than 80° relative to the impingement surface, such that a defect with a defect angle of less than 80° is formed by induced absorption within the transparent workpiece.

    METHODS AND APPARATUS FOR FORMING AND POLISHING GLASS, GLASS-CERAMIC AND CERAMIC PREFORMS TO FORM SHAPED PLATES FOR LIQUID LENSES

    公开(公告)号:US20210206693A1

    公开(公告)日:2021-07-08

    申请号:US17056590

    申请日:2019-05-20

    Abstract: A liquid lens that includes: a lens body comprising a first window, a second window, and a cavity disposed between the first window and the second window; and a first liquid and a second liquid within the cavity of the lens body, the first liquid and the second liquid substantially immiscible with each other and having different refractive indices such that an interface between the first liquid and second liquid to form a lens. The sidewall of the cavity has an average surface roughness (Ra) of less than or equal to 200 nanometers (nm). The cavity is disposed within a plate. Further, each of the windows and the plate comprises a glass, glass-ceramic or ceramic composition. In addition, a linearity of a first bottom portion of the sidewall in proximity to the base of the plate can be from 0 μm±5 μm.

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