公开(公告)号：US20240359359A1

公开(公告)日：2024-10-31

申请号：US18764847

申请日：2024-07-05

Applicant: CORNING INCORPORATED

Inventor： Raymond Victor Ayres ,  Keith Norman Bubb ,  Michael George Shultz ,  Patrick David Tepesch ,  Michael Brian Webb ,  Qing Zhou ,  Cheng-Gang Zhuang

IPC: B28B11/00 ,  B01D46/00 ,  B01D46/24 ,  C04B38/00

CPC classification number: B28B11/007 ,  B01D46/0001 ,  B01D46/2418 ,  C04B38/0012

Abstract: A method of plugging a filter, comprising: positioning a mask layer over the filter comprising a plurality of intersecting walls, wherein the intersecting walls define at least one channel between the intersecting walls; perforating the mask layer proximate the channel to form a hole, wherein the hole extends around a portion of a perimeter of the channel such that the mask layer defines a flap extending over a center of the channel; passing a plugging mixture into the channel through the hole in the mask layer; and sintering the plugging mixture to form a plug within the channel.

公开(公告)号：US20220176587A1

公开(公告)日：2022-06-09

申请号：US17430386

申请日：2020-01-27

Applicant: CORNING INCORPORATED

Inventor： Raymond Victor Ayres ,  Keith Norman Bubb ,  Michael George Shultz ,  Patrick David Tepesch ,  Michael Brian Webb ,  Qing Zhou ,  Cheng-Gang Zhuang

IPC: B28B11/00 ,  B01D46/00 ,  B01D46/24 ,  C04B38/00

Abstract: A method of plugging a filter, comprising: positioning a mask layer over the filter comprising a plurality of intersecting walls, wherein the intersecting walls define at least one channel between the intersecting walls; perforating the mask layer proximate the channel to form a hole, wherein the hole extends around a portion of a perimeter of the channel such that the mask layer defines a flap extending over a center of the channel; passing a plugging mixture into the channel through the hole in the mask layer; and sintering the plugging mixture to form a plug within the channel.

公开(公告)号：US20200254557A1

公开(公告)日：2020-08-13

申请号：US16776055

申请日：2020-01-29

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Andreas Simon Gaab ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Daniel Arthur Sternquist ,  Michael Brian Webb

IPC: B23K26/00

Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w0, and a Rayleigh range ZR that is greater than F D  π  w 0 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

公开(公告)号：US20210283713A1

公开(公告)日：2021-09-16

申请号：US17327194

申请日：2021-05-21

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Andreas Simon Gaab ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Daniel Arthur Sternquist ,  Michael Brian Webb

IPC: B23K26/00

Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ w 0 , 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

公开(公告)号：US11052481B2

公开(公告)日：2021-07-06

申请号：US16776055

申请日：2020-01-29

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Andreas Simon Gaab ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Daniel Arthur Sternquist ,  Michael Brian Webb

IPC: B23K26/00 ,  B23K26/362

Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w0, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ w 0 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

公开(公告)号：US20200283325A1

公开(公告)日：2020-09-10

申请号：US16809960

申请日：2020-03-05

Applicant: CORNING INCORPORATED

Inventor： Roni Daniel Levi ,  Michael Brian Webb

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/064 ,  B23K26/364 ,  B23K26/53

Abstract: A method for processing a transparent workpiece includes forming a closed contour in the transparent workpiece. The closed contour includes a plurality of defects in the transparent workpiece and has a rectilinear shape. Forming the closed contour includes directing a pulsed laser beam through an aspheric optical element and into the transparent workpiece to generate an induced absorption within the transparent workpiece and produce a defect within the transparent workpiece. Forming the closed contour also includes translating the pulsed laser beam focal line along a closed contour line having the rectilinear shape, thereby laser forming the plurality of defects of the closed contour. In addition, the method for processing the transparent workpiece includes etching the transparent workpiece with a chemical etching solution to separate a portion of the transparent workpiece along the closed contour, thereby forming an aperture extending through the transparent workpiece.