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公开(公告)号:US11951700B2
公开(公告)日:2024-04-09
申请号:US17602587
申请日:2020-04-09
IPC分类号: B29D30/00 , B29C70/72 , B60C23/04 , G06K19/077
CPC分类号: B29D30/0061 , B29C70/72 , B60C23/0493 , G06K19/07764 , B29D2030/0077
摘要: A method for encapsulating electronic devices comprises, successively, placing a profiled strip on a conveyor belt, the profiled strip comprising a base, at least one flap protruding with respect to said base; positioning an electronic device, in the longitudinal direction, on the receiving zone of the profiled strip; and plastically deforming the flap by application of an application force in a predetermined direction.