公开(公告)号：US11940233B2

公开(公告)日：2024-03-26

申请号：US17154785

申请日：2021-01-21

Applicant: CISCO TECHNOLOGY, INC.

Inventor： M. Baris Dogruoz ,  Mehmet Onder Cap ,  D. Brice Achkir ,  Joel Richard Goergen

IPC: F28F21/02 ,  F28D21/00 ,  F28F3/04

CPC classification number: F28F21/02 ,  F28D21/00 ,  F28F3/04 ,  F28D2021/0029 ,  F28F2280/06

Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.

公开(公告)号：US11980005B2

公开(公告)日：2024-05-07

申请号：US17528379

申请日：2021-11-17

Applicant: Cisco Technology, Inc.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20154 ,  H05K1/0203 ,  H05K2201/066

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US11751322B2

公开(公告)日：2023-09-05

申请号：US17703051

申请日：2022-03-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

CPC classification number: H05K1/0239 ,  H05K1/0242 ,  H05K2201/09245

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

公开(公告)号：US11330702B2

公开(公告)日：2022-05-10

申请号：US17079970

申请日：2020-10-26

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

公开(公告)号：US20210337657A1

公开(公告)日：2021-10-28

申请号：US17079970

申请日：2020-10-26

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

公开(公告)号：US11255897B2

公开(公告)日：2022-02-22

申请号：US16229717

申请日：2018-12-21

Applicant: Cisco Technology, Inc.

Inventor： Mohammed Ghouse ,  Shailesh Nayak ,  Damaruganath Pinjala ,  Rohit Dev Gupta ,  Mehmet Onder Cap

IPC: G01R31/28 ,  H05K1/02 ,  H05K1/18

Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

公开(公告)号：US11234342B2

公开(公告)日：2022-01-25

申请号：US16842505

申请日：2020-04-07

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US20220018891A1

公开(公告)日：2022-01-20

申请号：US17480773

申请日：2021-09-21

Applicant: Cisco Technology, Inc.

Inventor： Mohammed Ghouse ,  Shailesh Nayak ,  Damaruganath Pinjala ,  Rohit Dev Gupta ,  Mehmet Onder Cap

IPC: G01R31/28 ,  H05K1/02 ,  H05K1/18

Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

公开(公告)号：US20210112682A1

公开(公告)日：2021-04-15

申请号：US16842505

申请日：2020-04-07

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US12160948B2

公开(公告)日：2024-12-03

申请号：US18337724

申请日：2023-06-20

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).