公开(公告)号：US09881725B2

公开(公告)日：2018-01-30

申请号：US14550256

申请日：2014-11-21

Applicant: Cisco Technology, Inc.

Inventor： William Frank Edwards ,  Ki-Yuen Chau ,  Keith Frank Tharp ,  George Curtis ,  Kayen Lin

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/29 ,  H01F27/06 ,  H01F41/10 ,  H01F27/04 ,  H01F27/30 ,  H01R13/00 ,  H01R43/01 ,  H01R13/719 ,  H01F17/06 ,  H01F17/00 ,  H01R4/02 ,  H01R24/64 ,  H01R43/02 ,  H01R107/00

CPC classification number: H01F27/06 ,  H01F17/062 ,  H01F27/04 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/306 ,  H01F41/10 ,  H01F2017/0093 ,  H01F2027/065 ,  H01R4/023 ,  H01R4/027 ,  H01R13/00 ,  H01R13/719 ,  H01R24/64 ,  H01R43/01 ,  H01R43/0221 ,  H01R2107/00

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

公开(公告)号：US20180096774A1

公开(公告)日：2018-04-05

申请号：US15816604

申请日：2017-11-17

Applicant: Cisco Technology, Inc.

Inventor： William Frank Edwards ,  Ki-Yuen Chau ,  Keith Frank Tharp ,  George Curtis ,  Kayen Lin

IPC: H01F27/06 ,  H01F27/04 ,  H01F27/28 ,  H01F27/29 ,  H01R13/00 ,  H01F41/10 ,  H01R43/01 ,  H01R13/719 ,  H01F27/30 ,  H01F17/00 ,  H01R4/02 ,  H01R24/64 ,  H01F17/06 ,  H01R107/00 ,  H01R43/02

CPC classification number: H01F27/06 ,  H01F17/062 ,  H01F27/04 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/306 ,  H01F41/10 ,  H01F2017/0093 ,  H01F2027/065 ,  H01R4/023 ,  H01R4/027 ,  H01R13/00 ,  H01R13/719 ,  H01R24/64 ,  H01R43/01 ,  H01R43/0221 ,  H01R2107/00 ,  Y10T29/49194

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

公开(公告)号：US20160148743A1

公开(公告)日：2016-05-26

申请号：US14550256

申请日：2014-11-21

Applicant: Cisco Technology, Inc.

Inventor： William Frank Edwards ,  Ki-Yuen Chau ,  Keith Frank Tharp ,  George Curtis ,  Kayan Lin

IPC: H01F27/06 ,  H01F27/28 ,  H01F27/29 ,  H01F41/10

CPC classification number: H01F27/06 ,  H01F17/062 ,  H01F27/04 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H01F27/306 ,  H01F41/10 ,  H01F2017/0093 ,  H01F2027/065 ,  H01R4/023 ,  H01R4/027 ,  H01R13/00 ,  H01R13/719 ,  H01R24/64 ,  H01R43/01 ,  H01R43/0221 ,  H01R2107/00

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.

Abstract translation: 在一个实施方式中，一种装置被配置成有助于电子表面贴装封装的制造或组装。 该装置包括被配置为支持共模扼流圈的共模扼流圈。 该装置包括联接到共模扼流圈的端子触点。 端子触点与连接到共模扼流圈的导线对齐。 该装置包括支撑构件，其包括与连接到共模扼流圈的导线对准的导线支撑部分和构造成支撑共模扼流器基座的中心部分。

公开(公告)号：US20200059021A1

公开(公告)日：2020-02-20

申请号：US16105606

申请日：2018-08-20

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Qirong Lin ,  George Edward Curtis ,  Ki-Yuen Chau ,  Quan Lu ,  Xiaogang Li

IPC: H01R12/58

Abstract: In one embodiment, an eye of needle (EON) press-fit pin includes a base, a tip, and a compliant portion extending longitudinally between the base and the tip and comprising a pair of resilient deformable arms joined at opposite ends and defining an opening therebetween. The arms each include an outer surface for at least partial engagement with walls of an electrical via upon insertion therein. The outer surface of each of the arms includes a central segment having a flat longitudinal surface and converges from the central segment towards the base and the tip. The arms each further include an inner surface defining the opening and forming an elongated portion at each end of the opening for stress relief.

公开(公告)号：US10547128B1

公开(公告)日：2020-01-28

申请号：US16105606

申请日：2018-08-20

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Qirong Lin ,  George Edward Curtis ,  Ki-Yuen Chau ,  Quan Lu ,  Xiaogang Li

IPC: H01R12/58

Abstract: In one embodiment, an eye of needle (EON) press-fit pin includes a base, a tip, and a compliant portion extending longitudinally between the base and the tip and comprising a pair of resilient deformable arms joined at opposite ends and defining an opening therebetween. The arms each include an outer surface for at least partial engagement with walls of an electrical via upon insertion therein. The outer surface of each of the arms includes a central segment having a flat longitudinal surface and converges from the central segment towards the base and the tip. The arms each further include an inner surface defining the opening and forming an elongated portion at each end of the opening for stress relief.

公开(公告)号：US10446312B2

公开(公告)日：2019-10-15

申请号：US15816604

申请日：2017-11-17

Applicant: Cisco Technology, Inc.

Inventor： William Frank Edwards ,  Ki-Yuen Chau ,  Keith Frank Tharp ,  George Curtis ,  Kayen Lin

IPC: H01R43/00 ,  H01F27/06 ,  H01F27/28 ,  H01F27/29 ,  H01F41/10 ,  H01F27/04 ,  H01F27/30 ,  H01R13/00 ,  H01R43/01 ,  H01R13/719 ,  H01F17/06 ,  H01F17/00 ,  H01R4/02 ,  H01R24/64 ,  H01R43/02 ,  H01R107/00

Abstract: In one implementation, an apparatus is configured to aid in the manufacturing or assembling of electronic surface mount packages. The apparatus includes a common mode choke base configured to support a common mode choke. The apparatus includes terminal contacts coupled to the common mode choke base. The terminal contacts are aligned with wires connected to the common mode choke. The apparatus includes a support member including a wire supporting portion aligned with the wires connected to the common mode choke and a central portion configured to support the common mode choke base.