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公开(公告)号：US20240215196A1
公开(公告)日：2024-06-27
申请号：US18596926
申请日：2024-03-06
Applicant: Cisco Technology, Inc.
Inventor： Mehmet Onder Cap , Manigandan Boopalan , Joel Richard Goergen , Sandeep Mehdiratta , Manjunatha Reddy Shivashankara , Damaruganath Pinjala
CPC classification number: H05K7/20154 , H05K1/0203 , H05K2201/066
Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
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公开(公告)号：US20220078941A1
公开(公告)日：2022-03-10
申请号：US17528379
申请日：2021-11-17
Applicant: Cisco Technology, Inc.
Inventor： Mehmet Onder Cap , Manigandan Boopalan , Joel Richard Goergen , Sandeep Mehdiratta , Manjunatha Reddy Shivashankara , Damaruganath Pinjala
Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
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公开(公告)号：US10690868B1
公开(公告)日：2020-06-23
申请号：US16154589
申请日：2018-10-08
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Joel Richard Goergen , Mehmet Onder Cap , Arjun Jayaprakash , Damaruganath Pinjala , Marc Henry Mantelli , Umeshbabu Nandanan , Jatin Kohli , Rohit Dev Gupta
Abstract: In one embodiment, an apparatus includes an optical module comprising a first end for insertion into a network device and a second end extending from the network device when the optical module is inserted into the network device, and a thermal protective layer extending over a portion of the second end of the optical module, the thermal protective layer preventing direct contact with an external surface of the optical module during removal of the optical module from the network device. The thermal protective layer exposes a portion of the external surface of the second end of the optical module to allow heat to be released from the external surface of the optical module.
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公开(公告)号：US11980005B2
公开(公告)日：2024-05-07
申请号：US17528379
申请日：2021-11-17
Applicant: Cisco Technology, Inc.
Inventor： Mehmet Onder Cap , Manigandan Boopalan , Joel Richard Goergen , Sandeep Mehdiratta , Manjunatha Reddy Shivashankara , Damaruganath Pinjala
CPC classification number: H05K7/20154 , H05K1/0203 , H05K2201/066
Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
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5.发明申请公开(公告)号：US20200221596A1
公开(公告)日：2020-07-09
申请号：US16819399
申请日：2020-03-16
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rohit Dev Gupta , Joel Richard Goergen , Sarma VMK Vedhanabhatla , Damaruganath Pinjala , Jatin Kohli , Robert Gregory Twiss
Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20190008066A1
公开(公告)日：2019-01-03
申请号：US15639968
申请日：2017-06-30
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rohit Dev Gupta , Joel Richard Goergen , Sarma VMK Vedhanabhatla , Damaruganath Pinjala , Jatin Kohli , Robert Gregory Twiss
Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
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公开(公告)号：US11644500B2
公开(公告)日：2023-05-09
申请号：US17480773
申请日：2021-09-21
Applicant: Cisco Technology, Inc.
Inventor： Mohammed Ghouse , Shailesh Nayak , Damaruganath Pinjala , Rohit Dev Gupta , Mehmet Onder Cap
CPC classification number: G01R31/2808 , G01R31/2817 , H05K1/0209 , H05K1/181 , H05K2201/064
Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.
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8.发明申请公开(公告)号：US20210410312A1
公开(公告)日：2021-12-30
申请号：US17470465
申请日：2021-09-09
Applicant: Cisco Technology, Inc.
Inventor： Rohit Dev Gupta , Joel Richard Goergen , Sarma VMK Vedhanabhatla , Damaruganath Pinjala , Jatin Kohli , Robert Gregory Twiss
Abstract: A method that includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
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9.发明授权公开(公告)号：US11172587B2
公开(公告)日：2021-11-09
申请号：US16819399
申请日：2020-03-16
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rohit Dev Gupta , Joel Richard Goergen , Sarma V M K Vedhanabhatla , Damaruganath Pinjala , Jatin Kohli , Robert Gregory Twiss
Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
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10.发明授权公开(公告)号：US12137530B2
公开(公告)日：2024-11-05
申请号：US17470465
申请日：2021-09-09
Applicant: Cisco Technology, Inc.
Inventor： Rohit Dev Gupta , Joel Richard Goergen , Sarma V M K Vedhanabhatla , Damaruganath Pinjala , Jatin Kohli , Robert Gregory Twiss
Abstract: A method that includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
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