Liquid cooling system, liquid cooling method and electronic device-testing apparatus having the system

    公开(公告)号:US20230400478A1

    公开(公告)日:2023-12-14

    申请号:US18327148

    申请日:2023-06-01

    CPC classification number: G01R1/0458

    Abstract: A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.

    TEMPERATURE CONTROL SYSTEM AND METHOD FOR ELECTRONIC DEVICE-TESTING APPARATUS

    公开(公告)号:US20230400506A1

    公开(公告)日:2023-12-14

    申请号:US18316691

    申请日:2023-05-12

    CPC classification number: G01R31/2877 G01R31/2863

    Abstract: The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.

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