公开(公告)号：US20230349968A1

公开(公告)日：2023-11-02

申请号：US18299173

申请日：2023-04-12

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi OUYANG ,  Xin-Yi WU ,  Chien-Ming CHEN ,  Meng-Kung LU ,  Chia-Hung CHIEN

IPC: G01R31/28

CPC classification number: G01R31/2896 ,  G01R31/2887 ,  G01R31/2893

Abstract: The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.

公开(公告)号：US20180024162A1

公开(公告)日：2018-01-25

申请号：US15628069

申请日：2017-06-20

Applicant: CHROMA ATE INC.

Inventor： Chia-Hung CHIEN ,  Xin-Yi WU

IPC: G01R1/04 ,  G05D23/19 ,  G01R31/28

CPC classification number: G01R1/0458 ,  G01R1/44 ,  G01R31/2891 ,  G05D23/1919 ,  G05D23/24

Abstract: A temperature-controlled module for electronic devices and a testing apparatus provided with the same mainly include a temperature-controlled tray, an upper board and a dry-air supply device. The temperature-controlled tray includes holding cavities for accommodating electronic devices and a fluid chamber for cooling fluid. The upper board is furnished with through holes, while the upper board and the temperature-controlled tray are spaced by a predetermined distance. The dry-air supply device provides dry air to a space between the temperature-controlled tray and the upper board. Thereupon, by having cooling fluid to flow inside the temperature-controlled tray, the temperature-controlled tray can be kept in a lower predetermined temperature so as to rapidly cool down the electronic device. In addition, by providing the upper board and the dry-air supply device to allow dry air to flow through the surface of the electronic device, then the water-condensation phenomenon and air leakage can avoided.