Electronic device substrate, manufacturing method thereof, and electronic device

    公开(公告)号:US11749691B2

    公开(公告)日:2023-09-05

    申请号:US17847877

    申请日:2022-06-23

    CPC classification number: H01L27/1244 H01L27/1259

    Abstract: An electronic device substrate, a manufacturing method thereof, and an electronic device are provided. The electronic device substrate includes a base substrate, a first insulating layer, and light-emitting sub-units, a first conductive member and a second conductive member, which are on a side of the first insulating layer away from the base substrate. The light-emitting sub-units and the first conductive member are respectively in array region and periphery region, and the second conductive member is between the first conductive member and the array region; orthogonal projections of the first and second conductive members on the base substrate are spaced apart; each light-emitting sub-unit includes first and second driving electrodes, second driving electrodes of the light-emitting sub-units are integrated to form a first common electrode layer; the periphery region further includes a second common electrode layer electrically connected to the first conductive member and the first common electrode layer.

    Electronic Device Substrate, Manufacturing Method Thereof, and Electronic Device

    公开(公告)号:US20220336503A1

    公开(公告)日:2022-10-20

    申请号:US17847877

    申请日:2022-06-23

    Abstract: An electronic device substrate, a manufacturing method thereof, and an electronic device are provided. The electronic device substrate includes a base substrate, a first insulating layer, and light-emitting sub-units, a first conductive member and a second conductive member, which are on a side of the first insulating layer away from the base substrate. The light-emitting sub-units and the first conductive member are respectively in array region and periphery region, and the second conductive member is between the first conductive member and the array region; orthogonal projections of the first and second conductive members on the base substrate are spaced apart; each light-emitting sub-unit includes first and second driving electrodes, second driving electrodes of the light-emitting sub-units are integrated to form a first common electrode layer; the periphery region further includes a second common electrode layer electrically connected to the first conductive member and the first common electrode layer.

    Display panel and method for manufacturing display panel

    公开(公告)号:US11183542B2

    公开(公告)日:2021-11-23

    申请号:US16960573

    申请日:2019-08-23

    Abstract: A display panel and a method for manufacturing a display panel are disclosed. The display panel includes a first sub-pixel region and a second sub-pixel region which are adjacent to each other. The display panel includes a substrate and a first conductive layer, an organic functional layer, and a second conductive layer which are sequentially on the substrate. The organic functional layer includes a charge generation layer, and the charge generation layer includes a first charge generation layer portion and a second charge generation layer portion which are in the first sub-pixel region and the second sub-pixel region, respectively. The display panel further includes a spacer between the first sub-pixel region and the second sub-pixel region, and the spacer disconnects the first charge generation layer portion and the second charge generation layer portion.

    Display substrate having microcavities

    公开(公告)号:US11005063B2

    公开(公告)日:2021-05-11

    申请号:US16830087

    申请日:2020-03-25

    Abstract: A display substrate and a method for manufacturing the same are provided. The display substrate includes: a base substrate; a first-color sub-pixel region and a second-color sub-pixel region on the base substrate. The first-color sub-pixel region includes: a first reflective layer, a first isolation layer and a first anode layer, the first reflective layer and the first anode layer being electrically connected with each other through a first connection element which penetrates through the first isolation layer. The second-color sub-pixel region includes: a second reflective layer, a second isolation layer and a second anode layer, the second reflective layer and the second anode layer being electrically connected with each other through a second connection element which penetrates through the second isolation layer. Thicknesses of the first isolation layer and the second isolation layer are different.

    DISPLAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210098748A1

    公开(公告)日:2021-04-01

    申请号:US16830087

    申请日:2020-03-25

    Abstract: A display substrate and a method for manufacturing the same are provided. The display substrate includes: a base substrate; a first-color sub-pixel region and a second-color sub-pixel region on the base substrate. The first-color sub-pixel region includes: a first reflective layer, a first isolation layer and a first anode layer, the first reflective layer and the first anode layer being electrically connected with each other through a first connection element which penetrates through the first isolation layer. The second-color sub-pixel region includes: a second reflective layer, a second isolation layer and a second anode layer, the second reflective layer and the second anode layer being electrically connected with each other through a second connection element which penetrates through the second isolation layer. Thicknesses of the first isolation layer and the second isolation layer are different.

    Display substrate, fabricating method thereof and display panel

    公开(公告)号:US11997891B2

    公开(公告)日:2024-05-28

    申请号:US17259465

    申请日:2020-03-24

    CPC classification number: H10K59/131 H10K71/00 H10K59/1201

    Abstract: Provided is display substrate, including driving circuit board, and first electrode layer, insulating layer, second electrode layer, isolation layer, transparent conductive layer sequentially stacked thereon. Driving circuit board includes pixel and bonding regions. First electrode layer includes first sub-portion in bonding region and second sub-portion in pixel region. Insulating and isolation layers are partially cover bonding and pixel regions. Insulating layer has first via hole in area corresponding to first sub-portion. Isolation layer has second via hole in the area. Axes of first and second via holes coincide, first sub-portion is exposed at first and second via holes. Second electrode layer is in pixel region, coupled to second sub-portion through third via hole in area corresponding to second sub-portion. Isolation layer has fourth via hole in area corresponding to second electrode layer. Transparent conductive layer is in pixel region, coupled to second electrode layer through fourth via hole.

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