PROCESSING MULTILAYER SEMICONDUCTORS WITH MULTIPLE HEAT SOURCES
    1.
    发明申请
    PROCESSING MULTILAYER SEMICONDUCTORS WITH MULTIPLE HEAT SOURCES 审中-公开
    用多个热源处理多层半导体

    公开(公告)号:US20140003800A1

    公开(公告)日:2014-01-02

    申请号:US14014947

    申请日:2013-08-30

    CPC classification number: H01L21/02 H01L21/268 H01L21/324 H01L21/67115

    Abstract: A method and apparatus for rapid thermal annealing comprising a plurality of lamps affixed to a lid of the chamber that provide at least one wavelength of light, a laser source extending into the chamber, a substrate support positioned within a base of the chamber, an edge ring affixed to the substrate support, and a gas distribution assembly in communication with the lid and the base of the chamber. A method and apparatus for rapid thermal annealing comprising a plurality of lamps comprising regional control of the lamps and a cooling gas distribution system affixed to a lid of the chamber, a heated substrate support with magnetic levitation extending through a base of the chamber, an edge ring affixed to the substrate support, and a gas distribution assembly in communication with the lid and the base of the chamber.

    Abstract translation: 一种用于快速热退火的方法和装置,包括固定到室的盖上的多个灯,其提供至少一个波长的光,延伸到腔室中的激光源,位于腔室的基座内的基底支撑件, 固定到基板支撑件的环,以及与盖和基座的底部连通的气体分配组件。 一种用于快速热退火的方法和装置,包括多个灯,其包括灯的区域控制和固定到所述室的盖的冷却气体分配系统,具有延伸穿过所述室的基部的磁悬浮的加热衬底支撑件, 固定到基板支撑件的环,以及与盖和基座的底部连通的气体分配组件。

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