公开(公告)号：US20240371646A1

公开(公告)日：2024-11-07

申请号：US18611430

申请日：2024-03-20

Applicant: Applied Materials, Inc.

Inventor： Jimin ZHANG ,  Harry Q. LEE ,  Jianshe TANG ,  Brian J. BROWN

IPC: H01L21/304 ,  B24B37/013 ,  B24B37/04 ,  B24B49/10 ,  H01L21/66

Abstract: In one embodiment, a method of processing a substrate in a chemical mechanical polishing (CMP) system, comprises determining an orientation of a substrate relative to a first carrier head. The method further includes initiating a polishing process of a surface of the substrate engaged with a polishing pad. The method further includes scanning, during the polishing process, a first portion of the surface of the substrate repeatedly using at least one endpoint sensor coupled to the polishing pad to generate orientation dependent scan data of a property of the first portion of the surface. The method further includes comparing the orientation dependent scan data to a library of orientation dependent scan data to determine when the endpoint of the polishing process has been reached.

公开(公告)号：US20240165768A1

公开(公告)日：2024-05-23

申请号：US17989741

申请日：2022-11-18

Applicant: Applied Materials, Inc.

Inventor： Kun XU ,  Harry Q. LEE

IPC: B24B49/05 ,  B24B37/04 ,  B24B49/16

CPC classification number: B24B49/05 ,  B24B37/042 ,  B24B49/16

Abstract: An apparatus for processing a substrate, the apparatus comprising a polishing assembly and a controller. The polishing assembly is configured to (a) polish a surface of the substrate. The controller is configured to (b) detect a first substrate measurement corresponding to a first region of the substrate, (c) detect a second substrate measurement corresponding to a second region of the substrate; (d) determine a difference between the first substrate measurement at the first region and the second substrate measurement at the second region; stop the polishing of the surface of the substrate in response to a determination that the difference between the first substrate measurement and the second substrate measurement is within a tolerance threshold; and repeat (a)-(d) in response to a determination that the difference between the first substrate measurement and the second substrate measurement is outside of the tolerance threshold.