公开(公告)号：US20250112189A1

公开(公告)日：2025-04-03

申请号：US18673101

申请日：2024-05-23

Applicant: Apple Inc.

Inventor： Nicolas Hotellier ,  Christophe Verove ,  Amaud Laflaquiere ,  David Coulon ,  Siddharth Joshi ,  Stephane Zoll ,  Keith Lyon ,  Cristiano L. Niclass

IPC: H01L23/00 ,  H01L27/146 ,  H01S5/183

Abstract: An electronic device includes a set of semiconductor layers defining a set of semiconductor mesas. A first dielectric abuts the set of semiconductor layers at a perimeter of the set of semiconductor layers. A second dielectric is disposed on the set of semiconductor mesas. A set of conductors is routed in or on the second dielectric. The set of conductors is electrically connected to at least one active device defined in at least one semiconductor mesa of the set of semiconductor mesas. The set of conductors is configured to route electrical signals to or from the at least one semiconductor mesa, and the set of conductors includes a set of hybrid bonding pads on the second dielectric.