公开(公告)号：US20250112154A1

公开(公告)日：2025-04-03

申请号：US18643907

申请日：2024-04-23

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  Antonietta Oliva ,  Sambasivan Narayan ,  Jun Zhai ,  Vidhya Ramachandran ,  Kamal Sikka

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/367 ,  H01L23/427 ,  H01L23/473 ,  H01L23/48 ,  H01L23/522

Abstract: Chip structures and electronic modules including a power delivery network (PDN) routing structure and signal routing structure to balance power, signaling, and thermal requirements are described. In an embodiment, the chip includes a device layer, a PDN routing structure on top of the device layer, and a signal routing structure underneath the device layer.