公开(公告)号：US20140110882A1

公开(公告)日：2014-04-24

申请号：US14059238

申请日：2013-10-21

Applicant: Apple Inc.

Inventor： Jonathan S. Aase ,  Cameron P. Frazier ,  John E. Thomas

IPC: B29C45/14

CPC classification number: H02G15/18 ,  B29C33/10 ,  B29C39/42 ,  B29C43/18 ,  B29C43/203 ,  B29C43/36 ,  B29C45/14073 ,  B29C2043/3605 ,  B29C2043/3621 ,  B29C2043/3665 ,  B29C2045/1409 ,  B29C2045/14131 ,  B29K2105/256 ,  B29K2705/00 ,  B29L2031/3462

Abstract: A headset can include a cable structure connecting non-cable components such as jacks and headphones. The cable structure can be constructed using a molding process. Different approaches can be used to ensure that a conductor bundle extending through the cable structure remains centered within the cable structure during the molding process. A movable tube can be placed in the mold such that the conductor bundle is retained within the tube. As material is injected into the mold and reaches the tube, the tube can be displaced and progressively removed from the mold. Alternatively, the movable tube can be constructed such that the tube may combine with injected material to form a shell of the cable structure. Gates from which material is provided in the mold can be positioned and controlled to facilitate the injection of material in the mold while maintaining the centered position of the conductor bundle.

Abstract translation: 耳机可以包括连接诸如插孔和耳机之类的非电缆组件的电缆结构。 电缆结构可以使用成型工艺构造。 可以使用不同的方法来确保在模制过程中延伸穿过电缆结构的导体束在电缆结构内保持居中。 可移动管可以放置在模具中，使得导体束保持在管内。 当材料被注入到模具中并到达管时，管可以移动并逐渐从模具中移除。 或者，可移动管可以构造成使得管可以与注入的材料组合以形成电缆结构的外壳。 可以定位和控制在模具中提供材料的浇口，以便于在保持导体束的中心位置的同时在模具中注入材料。

公开(公告)号：US09640967B2

公开(公告)日：2017-05-02

申请号：US14059238

申请日：2013-10-21

Applicant: Apple Inc.

Inventor： Jonathan S. Aase ,  Cameron P. Frazier ,  John E. Thomas

IPC: B29C45/14 ,  H02G15/18 ,  B29C39/42 ,  B29C43/18 ,  B29C43/20 ,  B29C43/36 ,  B29C33/10 ,  B29K105/00 ,  B29K705/00 ,  B29L31/34

CPC classification number: H02G15/18 ,  B29C33/10 ,  B29C39/42 ,  B29C43/18 ,  B29C43/203 ,  B29C43/36 ,  B29C45/14073 ,  B29C2043/3605 ,  B29C2043/3621 ,  B29C2043/3665 ,  B29C2045/1409 ,  B29C2045/14131 ,  B29K2105/256 ,  B29K2705/00 ,  B29L2031/3462

Abstract: A headset can include a cable structure connecting non-cable components such as jacks and headphones. The cable structure can be constructed using a molding process. Different approaches can be used to ensure that a conductor bundle extending through the cable structure remains centered within the cable structure during the molding process. A movable tube can be placed in the mold such that the conductor bundle is retained within the tube. As material is injected into the mold and reaches the tube, the tube can be displaced and progressively removed from the mold. Alternatively, the movable tube can be constructed such that the tube may combine with injected material to form a shell of the cable structure. Gates from which material is provided in the mold can be positioned and controlled to facilitate the injection of material in the mold while maintaining the centered position of the conductor bundle.