公开(公告)号：US10431382B2

公开(公告)日：2019-10-01

申请号：US14841387

申请日：2015-08-31

Applicant: Apple Inc.

Inventor： Gemin Li ,  Paul Martinez ,  Benjamin A. Bard ,  Connor R. Duke ,  Zhong-Qing Gong ,  Kevin R. Richardson ,  Curtis C. Mead ,  Kieran Poulain ,  Sung Woo Yoo ,  Nelson J. Kottke

IPC: H05K7/00 ,  H01G4/30 ,  H01G4/224 ,  H05K3/28 ,  H01G2/06 ,  H05K1/18 ,  H05K1/14

Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

公开(公告)号：US20180061578A1

公开(公告)日：2018-03-01

申请号：US15694726

申请日：2017-09-01

Applicant: Apple Inc.

Inventor： Gang Ning ,  Paul A. Martinez ,  Amanda R. Rainer ,  Won Seop Choi ,  Gemin Li ,  Zhong-Qing Gong ,  Shawn X. Arnold

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/232 ,  H01G4/12 ,  H05K1/18

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1209 ,  H01G4/232 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10015

Abstract: Passive component structures that may save space, are readily manufactured, and are easy to use. In one example, a passive component structure may include two capacitors, each formed as a group of plates separate and apart from the other. The two groups of plates may have a spacing layer between them.

公开(公告)号：US20170064811A1

公开(公告)日：2017-03-02

申请号：US14841387

申请日：2015-08-31

Applicant: Apple Inc.

Inventor： Gemin Li ,  Paul Martinez ,  Benjamin A. Bard ,  Connor R. Duke ,  Zhong-Qing Gong ,  Kevin R. Richardson ,  Curtis C. Mead ,  Kieran Poulain ,  Sung Woo Yoo ,  Nelson J. Kottke

IPC: H05K1/02 ,  H05K1/11 ,  H01G4/30 ,  H05K3/40 ,  H01G4/224 ,  H05K1/18 ,  H05K3/30

CPC classification number: H01G4/30 ,  H01G2/06 ,  H01G4/224 ,  H05K1/141 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/2045 ,  H05K2203/1316 ,  H05K2203/1322

Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

Abstract translation: 公开了一种印刷电路板（PCB）组件，其具有安装在PCB上的几个电子部件和覆盖电子部件的阻尼层。 PCB组件的实施例包括将阻尼层限制在PCB上的包覆模制层。 PCB组件的实施例包括在电子部件的电容器和PCB之间的插入器。 还描述和要求保护其他实施例。