公开(公告)号：US09977464B2

公开(公告)日：2018-05-22

申请号：US14836943

申请日：2015-08-26

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dale N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  H01Q1/24 ,  B24B29/00 ,  B24B37/04 ,  B24C11/00 ,  B24B7/22 ,  G04B39/00 ,  B23K26/364 ,  B05D1/02 ,  B23K26/402 ,  B24C1/08 ,  G04B37/00 ,  B23K103/00

CPC classification number: G06F1/1637 ,  B05D1/02 ,  B23K26/364 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/54 ,  B24B7/228 ,  B24B29/005 ,  B24B37/04 ,  B24C1/08 ,  B24C11/00 ,  G04B37/0008 ,  G04B39/006 ,  G06F1/163 ,  H01Q1/243

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

公开(公告)号：US10691169B2

公开(公告)日：2020-06-23

申请号：US15975522

申请日：2018-05-09

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dale N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  G04B37/00 ,  B24B7/22 ,  G04B39/00 ,  B23K26/402 ,  H01Q1/24 ,  B28D5/00 ,  B24B29/00 ,  B24B37/04 ,  B24C11/00 ,  B23K26/364 ,  B05D1/02 ,  B24C1/08 ,  B23K103/00

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

公开(公告)号：US10164322B2

公开(公告)日：2018-12-25

申请号：US14469882

申请日：2014-08-27

Applicant: APPLE INC.

Inventor： Erik G. de Jong ,  Dale N. Memering ,  Jeffrey C. Mylvaganam

IPC: H01Q1/24 ,  H01Q1/27 ,  H01Q7/00

Abstract: An electronic device including a signal transmission system. The electronic device may include a housing, and a cover coupled to the housing and defining a groove formed in the cover. The electronic device may also include a signal transmission system positioned within the housing. The signal transmission system may include an antenna at least partially received within the groove formed in the cover. The antenna may have an antenna body, and a contact pad in electrical communication with the antenna body. The signal transmission system may also have a flexible member positioned adjacent the antenna body. The flexible member may contact the contact pad of the antenna.

公开(公告)号：US20180086662A1

公开(公告)日：2018-03-29

申请号：US15712746

申请日：2017-09-22

Applicant: Apple Inc.

Inventor： Victor Luzzato ,  Jeffrey C. Mylvaganam ,  Christopher C. Bartlow

IPC: C03C15/00 ,  C03C21/00 ,  C03C19/00 ,  C03B25/02

CPC classification number: C03C15/00 ,  C03B25/025 ,  C03C19/00 ,  C03C21/002 ,  C03C2218/34

Abstract: A method of processing a glass substrate including texturing the glass substrate to form a textured surface that includes a plurality of micro fractures extending from the textured surface into the substrate. And, thereafter, chemically etching the textured surface of the glass substrate to a depth sufficient to remove the micro fractures. The glass substrate can then be chemically strengthened after the etching step.

公开(公告)号：US20180284843A1

公开(公告)日：2018-10-04

申请号：US15975522

申请日：2018-05-09

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dele N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  B24B37/04 ,  B05D1/02 ,  B23K26/402 ,  G04B39/00 ,  G04B37/00 ,  B24C11/00 ,  B24C1/08 ,  B23K26/364 ,  B24B29/00 ,  B24B7/22 ,  B23K103/00 ,  H01Q1/24

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

公开(公告)号：US20160064800A1

公开(公告)日：2016-03-03

申请号：US14469882

申请日：2014-08-27

Applicant: APPLE INC.

Inventor： Erik G. de Jong ,  Dale N. Memering ,  Jeffrey C. Mylvaganam

IPC: H01Q1/24

CPC classification number: H01Q1/243 ,  H01Q1/273 ,  H01Q7/00

Abstract: An electronic device including a signal transmission system. The electronic device may include a housing, and a cover coupled to the housing and defining a groove formed in the cover. The electronic device may also include a signal transmission system positioned within the housing. The signal transmission system may include an antenna at least partially received within the groove formed in the cover. The antenna may have an antenna body, and a contact pad in electrical communication with the antenna body. The signal transmission system may also have a flexible member positioned adjacent the antenna body. The flexible member may contact the contact pad of the antenna.

Abstract translation: 一种包括信号传输系统的电子设备。 电子设备可以包括壳体和联接到壳体并限定形成在盖中的凹槽的盖。 电子设备还可以包括位于壳体内的信号传输系统。 信号传输系统可以包括至少部分地容纳在形成在盖中的凹槽内的天线。 天线可以具有天线体，以及与天线体电连通的接触垫。 信号传输系统还可以具有邻近天线体定位的柔性构件。 柔性构件可以接触天线的接触垫。

公开(公告)号：US20160062405A1

公开(公告)日：2016-03-03

申请号：US14836943

申请日：2015-08-26

Applicant: Apple Inc.

Inventor： Jeffrey C. Mylvaganam ,  Erik G. de Jong ,  Dale N. Memering ,  Xiao Bing Cai ,  Palaniappan Chinnakaruppan ,  Jong Kong Lee ,  Srikanth Kamireddi ,  Sawako Kamei ,  Feng Min ,  Jing Zhang ,  Xiang Du ,  Sai Feng Liu

IPC: G06F1/16 ,  B23K26/402 ,  B23K26/364 ,  B05D1/02 ,  B24C1/08

CPC classification number: G06F1/1637 ,  B05D1/02 ,  B23K26/364 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/54 ,  B24B7/228 ,  B24B29/005 ,  B24B37/04 ,  B24C1/08 ,  B24C11/00 ,  G04B37/0008 ,  G04B39/006 ,  G06F1/163 ,  H01Q1/243

Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

Abstract translation: 公开了一种用于电子设备的盖和形成盖的方法。 电子设备可以包括壳体和联接到壳体的盖。 盖可以具有内表面，其具有中间抛光剂和最终抛光剂中的至少一种，形成在内表面上的凹槽和与内表面相对定位的外表面。 外表面可以具有中间抛光剂和最终抛光剂中的至少一种。 盖子还可以具有形成在内表面和外表面之间的圆形周边部分。 圆形的周边部分可以邻近凹槽定位。 用于形成盖的方法可以包括使用抛光工具对蓝宝石部件进行第一抛光处理，并且使用喷砂介质对形成盖的蓝宝石部件的凹槽进行第二抛光处理。