公开(公告)号：US08084193B2

公开(公告)日：2011-12-27

申请号：US12172233

申请日：2008-07-12

申请人： Joy Cheng ,  Dario L Goldfarb ,  David R Medeiros ,  Daniel P Sanders ,  Dirk Pfeifer ,  Libor Vylicky

发明人： Joy Cheng ,  Dario L Goldfarb ,  David R Medeiros ,  Daniel P Sanders ,  Dirk Pfeifer ,  Libor Vylicky

IPC分类号： G03F7/30 ,  G03F7/11

CPC分类号： G03F7/091 ,  G03F7/0752 ,  Y10S430/136 ,  Y10S438/952 ,  Y10T428/24802

摘要： A coating process comprises forming a patterned material layer on a substrate using a self-segregating polymeric composition comprising a polymeric photoresistive material and an antireflective coating material. The polymeric photoresistive material and the antireflective coating material that make up the self segregating composition are contained in a single solution. When depositing this solution on a substrate and removing the solvent, the two materials self-segregate into two layers. The substrate can comprise one of a ceramic, dielectric, metal, or semiconductor material and in some instances a material such as a BARC material that is not from the self segregating composition. The composition may also contain a radiation-sensitive acid generator and a base quencher. This produces a coated substrate having a uniaxial bilayer coating oriented in a direction orthogonal to the substrate with a top photoresistive coating layer and a bottom antireflective coating layer. The process may also include optionally coating a top coat material on the coated substrate. Pattern-wise exposing the coated substrate to imaging radiation and contacting the coated substrate with a developer, produces the patterned material layer wherein the optional top coat material and a portion of the photoresist layer are simultaneously removed from the coated substrate, thereby forming a patterned photoresist layer on the substrate. Alternatively, the optional top coat material, a portion of the photoresist layer and a portion of the bottom antireflective layers are simultaneously removed from the coated substrate by the developer, thereby forming a patterned photoresist layer on the substrate.

摘要翻译： 涂覆方法包括使用包含聚合物光致抗蚀剂材料和抗反射涂层材料的自分离聚合物组合物在基材上形成图案化材料层。 构成自分离组合物的聚合物光致抗蚀剂材料和抗反射涂层材料包含在单一溶液中。 当将该溶液沉积在基材上并除去溶剂时，两种材料自分离成两层。 衬底可以包括陶瓷，电介质，金属或半导体材料中的一种，并且在一些情况下可以是不是来自自分离组合物的诸如BARC材料的材料。 组合物还可以含有辐射敏感性酸产生剂和碱猝灭剂。 这产生了具有单轴双层涂层的涂覆基材，该单轴双层涂层在垂直于基板的方向上具有顶部光刻胶涂层和底部抗反射涂层。 该方法还可以包括任选在涂覆的基材上涂覆顶涂层材料。 将涂覆的基底图案地曝光成成像辐射并使涂覆的基底与显影剂接触，产生图案化材料层，其中可任选的外涂层材料和光刻胶层的一部分同时从涂覆的基底上移除，从而形成图案化的光致抗蚀剂 层。 或者，可选的顶涂层材料，光致抗蚀剂层的一部分和底部抗反射层的一部分由显影剂同时从涂覆的基底上移除，从而在基板上形成图案化的光致抗蚀剂层。

公开(公告)号：US20100009132A1

公开(公告)日：2010-01-14

申请号：US12172233

申请日：2008-07-12

申请人： Joy Cheng ,  Dario L. Goldfarb ,  David R. Medeiros ,  Daniel P. Sanders ,  Dirk Pfeifer ,  Libor Vylicky

发明人： Joy Cheng ,  Dario L. Goldfarb ,  David R. Medeiros ,  Daniel P. Sanders ,  Dirk Pfeifer ,  Libor Vylicky

IPC分类号： G03F7/20 ,  G03F7/004 ,  B32B3/10

CPC分类号： G03F7/091 ,  G03F7/0752 ,  Y10S430/136 ,  Y10S438/952 ,  Y10T428/24802

摘要： A coating process comprises forming a patterned material layer on a substrate using a self-segregating polymeric composition comprising a polymeric photoresistive material and an antireflective coating material. The polymeric photoresistive material and the antireflective coating material that make up the self segregating composition are contained in a single solution. When depositing this solution on a substrate and removing the solvent, the two materials self-segregate into two layers. The substrate can comprise one of a ceramic, dielectric, metal, or semiconductor material and in some instances a material such as a BARC material that is not from the self segregating composition. The composition may also contain a radiation-sensitive acid generator and a base quencher. This produces a coated substrate having a uniaxial bilayer coating oriented in a direction orthogonal to the substrate with a top photoresistive coating layer and a bottom antireflective coating layer. The process may also include optionally coating a top coat material on the coated substrate. Pattern-wise exposing the coated substrate to imaging radiation and contacting the coated substrate with a developer, produces the patterned material layer wherein the optional top coat material and a portion of the photoresist layer are simultaneously removed from the coated substrate, thereby forming a patterned photoresist layer on the substrate. Alternatively, the optional top coat material, a portion of the photoresist layer and a portion of the bottom antireflective layers are simultaneously removed from the coated substrate by the developer, thereby forming a patterned photoresist layer on the substrate.

摘要翻译： 涂覆方法包括使用包含聚合物光致抗蚀剂材料和抗反射涂层材料的自分离聚合物组合物在基材上形成图案化材料层。 构成自分离组合物的聚合物光致抗蚀剂材料和抗反射涂层材料包含在单一溶液中。 当将该溶液沉积在基材上并除去溶剂时，两种材料自分离成两层。 衬底可以包括陶瓷，电介质，金属或半导体材料中的一种，并且在一些情况下可以是不是来自自分离组合物的诸如BARC材料的材料。 组合物还可以含有辐射敏感性酸产生剂和碱猝灭剂。 这产生了具有单轴双层涂层的涂覆基材，该单轴双层涂层在垂直于基板的方向上具有顶部光刻胶涂层和底部抗反射涂层。 该方法还可以包括任选在涂覆的基材上涂覆顶涂层材料。 将涂覆的基底图案地曝光成成像辐射并使涂覆的基底与显影剂接触，产生图案化材料层，其中可任选的外涂层材料和光刻胶层的一部分同时从涂覆的基底上移除，从而形成图案化的光致抗蚀剂 层。 或者，可选的顶涂层材料，光致抗蚀剂层的一部分和底部抗反射层的一部分由显影剂同时从涂覆的基底上移除，从而在基板上形成图案化的光致抗蚀剂层。