公开(公告)号：US07997758B2

公开(公告)日：2011-08-16

申请号：US12340488

申请日：2008-12-19

申请人： Yi Zhang ,  Cheng-Tien Lai ,  Jin-Song Feng ,  Wei-Le Wu

发明人： Yi Zhang ,  Cheng-Tien Lai ,  Jin-Song Feng ,  Wei-Le Wu

IPC分类号： F21V17/10

CPC分类号： F21V17/12 ,  F21K9/00 ,  Y10S362/80

摘要： An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED.

摘要翻译： LED光源包括LED模块和固定在LED模块上的导光模块。 LED模块包括印刷电路板和多个LED。 导光模块包括放置在LED模块上的框架和与框架接合的多个导光单元。 框架在其下部限定开口以将LED模块的LED接收到其中，并且其上部的凹部与开口连通。 每个导光单元具有一个具有两个凸缘的底座，两个凸缘分别适合地容纳在框架的凹部的两个切口中，使得导光单元可沿凹槽移动，直到其面对相应的LED。

公开(公告)号：US07564687B2

公开(公告)日：2009-07-21

申请号：US11690046

申请日：2007-03-22

申请人： Jie Liu ,  Chun-Jiang Shuai ,  Jin-Song Feng

发明人： Jie Liu ,  Chun-Jiang Shuai ,  Jin-Song Feng

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3677 ,  H01L2224/73253 ,  H01L2924/10156

摘要： A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite sides of the base. The fixing base includes a pair of side plates formed on a first set of two opposite sides thereof. A pair of resilient barbs extends inwards from an end portion of each side plate. The fixing base is placed on the heat sink and the resilient barbs tightly clasp first two opposite sides of the heat-generating device to press the base of the heat sink towards the heat-generating device. The flanges of the base of the heat sink abut second two opposite sides of the heat-generating device to avoid movement of the heat sink along a direction perpendicular to the flanges.

摘要翻译： 散热装置包括散热器和用于将散热器固定到发热装置的固定基座。 散热器包括基部和形成在基部的两个相对侧上的一对凸缘。 固定底座包括形成在其第一组两个相对侧上的一对侧板。 一对弹性倒钩从每个侧板的端部向内延伸。 固定基座放置在散热器上，弹性倒钩将发热装置的前两相对紧紧地夹紧，将散热片的底部朝向发热装置推压。 散热器底座的凸缘邻接发热装置的第二相对侧，以避免散热器沿垂直于凸缘的方向移动。

公开(公告)号：US20090141494A1

公开(公告)日：2009-06-04

申请号：US12024964

申请日：2008-02-01

申请人： Wen-Xiang Zhang ,  Guang Yu ,  Jin-Song Feng ,  Zhi-Yong Zhou

发明人： Wen-Xiang Zhang ,  Guang Yu ,  Jin-Song Feng ,  Zhi-Yong Zhou

IPC分类号： F21V17/02 ,  F21V21/00 ,  F21V29/00

CPC分类号： F21K9/00 ,  F21K9/65 ,  F21V14/02 ,  F21V19/02 ,  F21V29/73 ,  F21V29/74 ,  F21V29/75 ,  F21V29/763 ,  F21V29/77 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10

摘要： An LED lamp includes a first heat sink, a second heat sink and a plurality of LED modules. The second heat sink is located at a lateral side of the first heat sink and pivotally connects with the first heat sink. The LED modules are evenly attached on bottoms of the first and second heat sinks. The second heat sink can be rotated relative to the first heat sink to be fixed at a required position, whereby an illumination angle of the LED lamp can be adjusted. Heat generated by the LED modules is dissipated by the first and second heat sinks.

摘要翻译： LED灯包括第一散热器，第二散热器和多个LED模块。 第二散热器位于第一散热器的侧面并与第一散热器枢转连接。 LED模块均匀地附着在第一和第二散热器的底部。 第二散热器可以相对于第一散热器旋转以固定在所需位置，从而可以调节LED灯的照明角度。 由LED模块产生的热量由第一和第二散热器消散。

公开(公告)号：US20120261170A1

公开(公告)日：2012-10-18

申请号：US13532810

申请日：2012-06-26

申请人： JIN WANG ,  JIN-SONG FENG

发明人： JIN WANG ,  JIN-SONG FENG

IPC分类号： H05K1/02

CPC分类号： H05K7/142

摘要： An electronic device includes a printed circuit board, an electronic element, and a backboard assembly. The printed circuit board defines a plurality of first through holes. The electronic element is mounted on a top surface of the printed circuit board. The backboard is assembly secured to a bottom surface of the printed circuit board. The backboard assembly includes a back plate, an electrically insulative sheet, and a connection element. The electrically insulative sheet defines a plurality of second through holes. The connection element includes a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of first clasps on a second side of the connection element opposing to the first side to engage with the electrically insulative sheet.

摘要翻译： 电子设备包括印刷电路板，电子元件和背板组件。 印刷电路板限定多个第一通孔。 电子元件安装在印刷电路板的顶表面上。 背板是固定到印刷电路板的底表面的组件。 背板组件包括背板，电绝缘片和连接元件。 电绝缘片限定多个第二通孔。 所述连接元件包括在其第一侧上与所述背板接合的多个第一接合结构以及在所述连接元件的与所述第一侧相对的第二侧上与所述电绝缘片接合的多个第一扣环。

公开(公告)号：US07885072B2

公开(公告)日：2011-02-08

申请号：US12417605

申请日：2009-04-02

申请人： Wei-Le Wu ,  Jin-Song Feng ,  Cheng-Tien Lai

发明人： Wei-Le Wu ,  Jin-Song Feng ,  Cheng-Tien Lai

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L23/467 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.

摘要翻译： 定影装置将具有基座的散热器固定在具有不同规格的主板之一上。 具有相应规格的每个主板限定了穿过其中的多个延伸的孔。 定影装置包括多个板条，每个板条的端部枢转地连接到散热器的底部，并且其另一端限定用于对应于一个主板的一个延伸孔的细长槽，限定 与主板的延伸孔相对应的多个安装孔，以及延伸穿过板条槽的多个固定单元，一个主板的延伸孔和背板的相应安装孔，以安装散热片 在主板之一上。

公开(公告)号：US20080174968A1

公开(公告)日：2008-07-24

申请号：US11626734

申请日：2007-01-24

申请人： JIN-SONG FENG ,  SONG-SHUI LIU

发明人： JIN-SONG FENG ,  SONG-SHUI LIU

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink, a retention module and a locking device for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat-generating component. The retention module includes a bottom wall and a first spring clip secured at one side thereof. The locking device is pivotably connected to the retention module and includes a second spring clip attached thereon. The heat sink rests on the bottom wall of the retention module with an end thereof being pressed by the first spring clip, and an opposite end thereof being pressed by the second spring clip. The locking device can be at a released position where the locking device is pivotable, so that the heat sink is removable from the retention module, and a locked position where the locking device presses the base of the heat sink.

摘要翻译： 散热装置包括散热器，保持模块和用于将散热器固定到保持模块的锁定装置。 散热器包括用于与发热部件接触的基座。 保持模块包括底壁和固定在其一侧的第一弹簧夹。 锁定装置可枢转地连接到保持模块并且包括附接在其上的第二弹簧夹。 散热片搁置在保持模块的底壁上，其一端由第一弹簧夹压紧，其另一端被第二弹簧夹压。 锁定装置可以处于释放位置，在该位置锁定装置可枢转，使得散热器可从保持模块移除，锁定装置可以锁定装置按压散热器的底部。

公开(公告)号：US20050117306A1

公开(公告)日：2005-06-02

申请号：US10953654

申请日：2004-09-29

申请人： Hsieh-Kun Lee ,  Wan-Lin Xia ,  Bao-Chun Chen ,  Bo-Yong Yang ,  Jin-Song Feng ,  Tao Li

发明人： Hsieh-Kun Lee ,  Wan-Lin Xia ,  Bao-Chun Chen ,  Bo-Yong Yang ,  Jin-Song Feng ,  Tao Li

IPC分类号： G06F1/20 ,  H01L23/34 ,  H01L23/40 ,  H01L23/427 ,  H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.

摘要翻译： 一种用于电子部件（70）的散热装置组件，包括用于接触电子部件的散热器（10）和用于将散热器协同地安装到电子部件的锁定装置（20）和后板单元（40） 零件。 锁定装置包括位于电子部件周围的用于在其上支撑散热器的保持模块（28），以及可枢转地连接到保持模块的夹子（30）。 夹子包括按压部分和推动部分。 夹子可在其中夹子将散热器朝向电子部件按压的第一位置和夹子沿远离电子部件的方向推动散热器的第二位置之间枢转。

公开(公告)号：US08248802B2

公开(公告)日：2012-08-21

申请号：US12581179

申请日：2009-10-19

申请人： Jin Wang ,  Jin-Song Feng

发明人： Jin Wang ,  Jin-Song Feng

IPC分类号： H05K7/20 ,  H05K1/11

CPC分类号： H05K7/142

摘要： A backboard assembly includes a back plate, an electrically insulative sheet and a connection element. The connection element comprises a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of second engaging structures on a second side opposing to the first side to engage with the electrically insulative sheet.

摘要翻译： 背板组件包括背板，电绝缘片和连接元件。 连接元件包括在其第一侧上的多个第一接合结构，其与背板接合并且在与第一侧相对的第二侧上与多个第二接合结构接合以与电绝缘片接合。

公开(公告)号：US07768784B2

公开(公告)日：2010-08-03

申请号：US12269858

申请日：2008-11-12

申请人： Cheng-Tien Lai ,  Jin-Song Feng

发明人： Cheng-Tien Lai ,  Jin-Song Feng

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

摘要翻译： 散热组件包括散热器，围绕散热器的保持模块以及可枢转地连接到保持模块的一对线夹，以将散热器压靠印刷电路板上的电子部件。 保持模块包括围绕矩形开口的三个壁，散热器通过该壁与电子部件接触。 在三面墙上形成两个倒钩和两个支撑构件。 每个夹具包括保持在一个支撑构件中的枢转部分，将热沉朝向电子部件按压的邻接部分，以及一个锁定在一个倒钩上的锁定部分，连接该邻接部分与枢转部分的连接部分以及由 锁定部分。 每个夹子完全位于散热器的相应侧。

公开(公告)号：US20100002438A1

公开(公告)日：2010-01-07

申请号：US12396475

申请日：2009-03-03

申请人： YI ZHANG ,  CHENG-TIEN LAI ,  JIN-SONG FENG

发明人： YI ZHANG ,  CHENG-TIEN LAI ,  JIN-SONG FENG

IPC分类号： F21V21/00

CPC分类号： F21V29/763 ,  F21K9/00 ,  F21V19/003 ,  F21V29/51 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10

摘要： An LED lamp includes a heat sink having a base and a plurality of LED module assemblies mounted on a top surface of the base of the heat sink. Each of the LED module assemblies includes a fixing bracket secured to the top surface of the base, an LED module mounted on a top surface of the fixing bracket and two heat pipes engaging with the fixing bracket and the heat sink. The fixing bracket includes a bottom plate attached on the top surface of the base, a top plate on which the LED module is attached and a connecting plate interconnecting the bottom plate with the top plate. The heat pipes thermally connect the bottom plate and the heat sink with the top plate.

摘要翻译： LED灯包括具有基座的散热器和安装在散热器的基座的顶表面上的多个LED模块组件。 每个LED模块组件包括固定到基座顶面的固定支架，安装在固定支架顶表面上的LED模块和与固定支架和散热片相接合的两个热管。 固定支架包括安装在基座顶表面上的底板，安装有LED模块的顶板和将底板与顶板互连的连接板。 热管将顶板和散热器与顶板热连接。