- 专利标题: Semiconductor device having ESD protection structure
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申请号: US15308574申请日: 2015-05-04
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公开(公告)号: US09953970B2公开(公告)日: 2018-04-24
- 发明人: Guangsheng Zhang , Sen Zhang
- 申请人: CSMC TECHNOLOGIES FAB1 CO., LTD.
- 申请人地址: CN Wuxi New District, Jiangsu
- 专利权人: CSMC TECHNOLOGIES FAB1 CO., LTD.
- 当前专利权人: CSMC TECHNOLOGIES FAB1 CO., LTD.
- 当前专利权人地址: CN Wuxi New District, Jiangsu
- 代理机构: Kagan Binder, PLLC
- 优先权: CN201410184376 20140504
- 国际申请: PCT/CN2015/078222 WO 20150504
- 国际公布: WO2015/169197 WO 20151112
- 主分类号: H01L27/02
- IPC分类号: H01L27/02 ; H01L23/60 ; H01L29/73 ; H01L23/535 ; H01L29/739
摘要:
The present disclosure relates to a semiconductor device with an ESD protection structure. The semiconductor device includes a high-voltage power device 101, the ESD protection structure is a NMOS transistor 102, a drain of the NMOS transistor is shared by a source of the power device as a common-drain-source structure 107, substrate leading-out regions of the power device 101 and the NMOS transistor are coupled to the source 106 of the NMOS transistor as a ground leading-out. In the present disclosure, the drain of the NMOS transistor is shared by the source of the power device, so the increased area of the device with the ESD protection structure incorporated is small. In addition, the holding voltage at the source of the high-voltage power device is relatively low, which helps to protect the gate oxide and improve the source reliability.
公开/授权文献
- US20170062405A1 SEMICONDUCTOR DEVICE HAVING ESD PROTECTION STRUCTURE 公开/授权日:2017-03-02
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