Invention Grant
- Patent Title: Method of manufacturing nitride semiconductor substrate
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Application No.: US15399898Application Date: 2017-01-06
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Publication No.: US09947530B2Publication Date: 2018-04-17
- Inventor: Young Jo Tak , Sam Mook Kang , Mi Hyun Kim , Jun Youn Kim , Young Soo Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2016-0073871 20160614
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/205 ; H01L21/304 ; H01L21/3065 ; H01L21/02 ; H01L21/306

Abstract:
A method of manufacturing a nitride semiconductor substrate includes providing a silicon substrate having a first surface and a second surface opposing each other, growing a nitride template on the first surface of the silicon substrate in a first growth chamber, in which a silicon compound layer is formed on the second surface of the silicon substrate in a growth process of the nitride template, removing the silicon compound layer from the second surface of the silicon substrate, growing a group III nitride single crystal on the nitride template in a second growth chamber, and removing the silicon substrate from the second growth chamber.
Public/Granted literature
- US20170358443A1 METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR SUBSTRATE Public/Granted day:2017-12-14
Information query
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