Invention Grant
- Patent Title: Board-edge interconnection module with integrated capacitive coupling for enabling ultra-mobile computing devices
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Application No.: US14863974Application Date: 2015-09-24
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Publication No.: US09893444B2Publication Date: 2018-02-13
- Inventor: Jackson Chung Peng Kong , Eng Huat Goh , Bok Eng Cheah , Su Sin Florence Phun , Khang Choong Yong , Min Keen Tang
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Priority: MYPI2014703803 20141215
- Main IPC: H01R12/73
- IPC: H01R12/73 ; H01R12/72 ; C25D7/00 ; C25D5/34 ; C25D5/48 ; H01R13/66 ; H05K3/00 ; H01G4/06 ; H01G4/228 ; H01G4/40
Abstract:
A board-edge interconnection module features integrated capacitive coupling, which enables a board design employing the module to avoid having AC capacitors and flexible cables with bulky connectors. The recovered real estate enables further miniaturization, enabling the component to be used on a wide variety of devices, including ultra-mobile computing devices.
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