公开(公告)号：US11189574B2

公开(公告)日：2021-11-30

申请号：US16606628

申请日：2017-05-31

Applicant: Intel Corporation

Inventor： Li-Sheng Weng ,  Chung-Hao Chen ,  James C. Matayabas, Jr. ,  Min Keen Tang

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/00 ,  H05K9/00

Abstract: A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.

公开(公告)号：US20160380386A1

公开(公告)日：2016-12-29

申请号：US14750846

申请日：2015-06-25

Applicant: Intel Corporation

Inventor： Jackson Chung Peng Kong ,  Kuan-Yu Chen ,  Bok Eng Cheah ,  Boon Ping Koh ,  Min Keen Tang ,  Howard L. Heck ,  Kooi Chi Ooi

IPC: H01R13/648 ,  H01R13/42

CPC classification number: H01R13/6485 ,  H05K9/0067

Abstract: In one example an electronic device comprises a housing, a receptacle in the housing comprising an opening at a distal end to receive a plug, a data connector positioned in the receptacle to provide a communication connection, and an electrostatic conductor assembly positioned proximate the opening in the receptacle, wherein the electrostatic conductor assembly comprises a dedicated discharge path and a conductive pin mounted on a retention latch and moveable between a first position in which the conductive pin is in electrical contact with the data connector and a second position in which the conductive pin is not in electrical contact with the data connector. Other examples may be described.

Abstract translation: 在一个示例中，电子设备包括壳体，壳体中的插座，包括在远端处的接收插头的开口，位于插座中的数据连接器以提供通信连接，以及定位在开口附近的静电导体组件 插座，其中所述静电导体组件包括专用放电路径和安装在保持闩锁上的导电针，并且可在所述导电针与所述数据连接器电接触的第一位置和在所述第二位置之间移动的第二位置， 不与数据连接器电接触。 可以描述其他示例。

公开(公告)号：US10522898B2

公开(公告)日：2019-12-31

申请号：US15756923

申请日：2016-08-30

Applicant: INTEL CORPORATION

Inventor： Min Keen Tang ,  Ana M. Yepes ,  Yaniv Michaeli ,  Menashe Soffer

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q21/28

Abstract: Generally, this disclosure provides systems, devices and methods for integration of millimeter wave antennas in platforms with reduced form factors while maintaining or improving antenna gain. An antenna assembly may include a first planar substrate; a ground plane disposed on the first planar substrate; a second planar substrate disposed on the ground plane; and an antenna radiation element disposed on the second planar substrate. The antenna radiation element may be configured to transmit a signal in the millimeter wave frequency region. The assembly may also include a via to provide a conductive path for the signal from a microstrip feed line, beneath the first planar substrate, to the antenna radiation element. The assembly may further include a dielectric layer disposed on the antenna radiation element to provide increased antenna gain under conditions of reduced air gap between the antenna radiation element and a structural element of an enclosing platform.

公开(公告)号：US09900976B1

公开(公告)日：2018-02-20

申请号：US15376469

申请日：2016-12-12

Applicant: Intel Corporation

Inventor： Chung-Hao Chen ,  Min Keen Tang ,  Li-Sheng Weng

IPC: H05K9/00 ,  H05K1/02 ,  G06F1/16

CPC classification number: H05K1/0216 ,  G06F1/1698 ,  H05K1/0243 ,  H05K3/0061

Abstract: Apparatus and method to provide integrated circuit (IC) package integrity without adverse performance degradation are disclosed herein. In some embodiments, an apparatus may include one or more integrated circuits (ICs); a metallic structure that encircles the one or more ICs without being in contact with the one or more ICs, wherein the metallic structure is without an electrical ground; and a conductive epoxy layer disposed below and in contact with the metallic structure, wherein the conductive epoxy is to reduce an electromagnetic field induced by the metallic structure in response to a presence of a wireless signal that operates at approximately a resonant frequency associated with the metallic structure.

公开(公告)号：US20160211619A1

公开(公告)日：2016-07-21

申请号：US14601403

申请日：2015-01-21

Applicant: Intel Corporation

Inventor： Jackson Chung Peng Kong ,  Bok Eng Cheah ,  Howard L Heck ,  Kuan-Yu Chen ,  Boon Ping Koh ,  Min Keen Tang ,  Kooi Chi Ooi

IPC: H01R13/648 ,  H01R24/66

CPC classification number: H01R13/6485 ,  H01R24/66 ,  H01R2107/00

Abstract: In one example an electronic device comprises a housing. A receptacle in the housing comprising an opening at a distal end to receive a plug and an electrostatic conductor assembly positioned proximate the opening in the receptacle, wherein the electrostatic conductor assembly is coupled to a dedicated electrical discharge path. Other examples may be described.

Abstract translation: 在一个示例中，电子设备包括壳体。 壳体中的容器包括在远端处的开口，用于容纳插头和靠近插座中的开口定位的静电导体组件，其中静电导体组件耦合到专用放电路径。 可以描述其他示例。

公开(公告)号：US20210118809A1

公开(公告)日：2021-04-22

申请号：US16606628

申请日：2017-05-31

Applicant: Intel Corporation

Inventor： Li-Sheng Weng ,  Chung-Hao Chen ,  James C. Matayabas, Jr. ,  Min Keen Tang

IPC: H01L23/552 ,  H01L23/31 ,  H05K9/00 ,  H01L23/00

Abstract: A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.

公开(公告)号：US09893444B2

公开(公告)日：2018-02-13

申请号：US14863974

申请日：2015-09-24

Applicant: INTEL CORPORATION

Inventor： Jackson Chung Peng Kong ,  Eng Huat Goh ,  Bok Eng Cheah ,  Su Sin Florence Phun ,  Khang Choong Yong ,  Min Keen Tang

IPC: H01R12/73 ,  H01R12/72 ,  C25D7/00 ,  C25D5/34 ,  C25D5/48 ,  H01R13/66 ,  H05K3/00 ,  H01G4/06 ,  H01G4/228 ,  H01G4/40

CPC classification number: H01R12/721 ,  C23C18/1653 ,  C25D5/34 ,  C25D5/48 ,  C25D7/00 ,  H01G4/06 ,  H01G4/228 ,  H01G4/40 ,  H01R12/732 ,  H01R13/6625 ,  H05K1/117 ,  H05K1/162 ,  H05K3/00 ,  H05K2201/0187

Abstract: A board-edge interconnection module features integrated capacitive coupling, which enables a board design employing the module to avoid having AC capacitors and flexible cables with bulky connectors. The recovered real estate enables further miniaturization, enabling the component to be used on a wide variety of devices, including ultra-mobile computing devices.