- 专利标题： Electroless copper plating compositions
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申请号： US14332326申请日： 2014-07-15
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公开(公告)号： US09869026B2公开(公告)日： 2018-01-16
- 发明人: David S. Laitar , Crystal P. L. Li , Andy Lok-Fung Chow
- 申请人： Rohm and Haas Electronic Materials LLC , Dow Global Technologies LLC
- 申请人地址： US MA Marlborough US MI Midland
- 专利权人： Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC,Dow Global Technologies LLC
- 当前专利权人地址： US MA Marlborough US MI Midland
- 代理商 John J. Piskorski
- 主分类号： C23C18/40
- IPC分类号： C23C18/40 ; H05K3/00 ; H05K3/18 ; C23C18/16 ; C23C18/54 ; H05K3/42
摘要：
Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
公开/授权文献
- US20160017498A1 ELECTROLESS COPPER PLATING COMPOSITIONS 公开/授权日：2016-01-21
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