A method for manufacturing a multilayer circuit board includes: forming a first patterned conductive layer on a ceramic substrate, the first patterned conductive layer having a first circuit pattern and a first submount pattern; forming a second patterned conductive layer on the first patterned conductive layer, the second patterned conductive layer having a second circuit pattern and a second submount pattern; forming an insulating layer on the ceramic substrate; and forming a third patterned conductive layer on the insulating layer. The third patterned conductive layer having a third circuit pattern and a third submount pattern. The first, second and third submount patterns are stacked one above another.