- 专利标题： Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond
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申请号： US15149309申请日： 2016-05-09
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公开(公告)号： US09793057B2公开(公告)日： 2017-10-17
- 发明人: John E. McConnell , Garry L. Renner , John Bultitude
- 申请人： Kemet Electronics Corporation
- 申请人地址： US SC Simpsonville
- 专利权人： KEMET Electronics Corporation
- 当前专利权人： KEMET Electronics Corporation
- 当前专利权人地址： US SC Simpsonville
- 代理机构： Perkins Law Firm, LLC
- 代理商 Joseph T. Guy
- 主分类号： H01G9/00
- IPC分类号： H01G9/00 ; H01G9/07 ; H01G9/008 ; H01G9/045 ; B23K1/00 ; B23K1/005 ; B23K1/008 ; B23K1/20 ; B23K35/36 ; B23K35/02 ; H01G4/30 ; H01G4/005 ; H01G4/232 ; B23K35/28 ; B23K101/42
摘要：
An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.
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