- 专利标题: Trench to trench fin short mitigation
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申请号: US15273972申请日: 2016-09-23
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公开(公告)号: US09780094B2公开(公告)日: 2017-10-03
- 发明人: Veeraraghavan S. Basker , Alexander Reznicek
- 申请人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Matthew C. Zehrer
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L29/94 ; H01L29/78
摘要:
A semiconductor structure includes a replacement strap for a finFET fin that provides communication between a storage capacitor and the fin. The storage capacitor is located in a deep trench formed in a substrate and the fin is formed on a surface of the substrate. The replacement strap allows for electrical connection of the fin to the storage capacitor and is in direct physical communication with the fin and the storage capacitor. The replacement strap may be formed by removing a sacrificial strap and merging epitaxially grown material from the fin and epitaxially grown material from the capacitor. The epitaxially grown material grown from the fin grows at a slower rate relative to the epitaxially grown material grown from the capacitor. By removing the sacrificial strap prior to forming the replacement strap, epitaxial overgrowth that may cause shorts between adjacent capacitors is limited.
公开/授权文献
- US20170012047A1 TRENCH TO TRENCH FIN SHORT MITIGATION 公开/授权日:2017-01-12
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